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Machine translation
1. (WO2004009240) COMPONENT SEPARATING DEVICE, METHOD OF MANUFACTURING THE DEVICE, AND METHOD OF SEPARATING FINE SOLID COMPONENT BY USING THE DEVICE
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2004/009240    International Application No.:    PCT/JP2003/008714
Publication Date: 29.01.2004 International Filing Date: 09.07.2003
IPC:
B01L 3/00 (2006.01), G01N 1/28 (2006.01)
Applicants: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. [JP/JP]; 1006, Oaza Kadoma, Kadoma-shi, Osaka 571-8501 (JP) (For All Designated States Except US).
NAKATANI, Masaya [JP/JP]; (JP) (For US Only)
Inventors: NAKATANI, Masaya; (JP)
Agent: IWAHASHI, Fumio; c/o Matsushita Electric Industrial Co., Ltd., 1006, Oaza Kadoma, Kadoma-shi, Osaka 571-8501 (JP)
Priority Data:
2002-212031 22.07.2002 JP
Title (EN) COMPONENT SEPARATING DEVICE, METHOD OF MANUFACTURING THE DEVICE, AND METHOD OF SEPARATING FINE SOLID COMPONENT BY USING THE DEVICE
(FR) SEPARATEUR DE COMPOSANTS, SON PROCEDE DE FABRICATION ET PROCEDE DE SEPARATION DE COMPOSANTS SOLIDES FINS UTILISANT LE SEPARATEUR
(JA) 成分分離デバイスとその製造方法及びこれを用いた微小固形成分の分離方法
Abstract: front page image
(EN)A component separating device, comprising a well (2) for storing separated sample installed on a stage (1) fixedly to only the bottom surface one point of the stage (1) and a base (13) formed on the stage (1), the base (13) further comprising an actuator for vibrating the well (2).
(FR)L'invention porte sur un séparateur de composants comprenant un puits (2) de stockage d'échantillons séparés placé sur une platine et lui étant fixé par un unique point, et une base (13) formée sur la platine (1) et comportant en outre un vibrateur faisant vibrer le puits (2).
(JA)ステージ(1)上に、分離する対象物のサンプルを収容出来るウエル(2)を有し、ウエル(2)は底面の一点でのみステージ(1)に固定され、前記ステージ(1)上に形成されたベース(13)が、ウエル(2)を振動させるアクチュエータをさらに有する。
Designated States: CN, JP, US.
European Patent Office (AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HU, IE, IT, LU, MC, NL, PT, RO, SE, SI, SK, TR).
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)