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Machine translation
1. (WO2004008532) HIGH POWER MCM PACKAGE
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2004/008532    International Application No.:    PCT/US2003/022160
Publication Date: 22.01.2004 International Filing Date: 15.07.2003
IPC:
H01L 25/07 (2006.01)
Applicants: INTERNATIONAL RECTIFIER CORPORATION [US/US]; 233 Kansas Street, El Segundo, CA 90245 (US)
Inventors: SCHAFFER, Christopher, P.; (US)
Agent: DUJMICH, Louis, C.; Ostrolenk, Faber, Gerb & Soffen, LLP, 1180 Avenue of the Americas, New York, NY 10036 (US)
Priority Data:
60/396,342 15.07.2002 US
10/620,029 14.07.2003 US
Title (EN) HIGH POWER MCM PACKAGE
(FR) ENSEMBLE DE MODULE MULTIPUCE HAUTE PUISSANCE
Abstract: front page image
(EN)A multi-chip module (54) that includes a conductive element to serve as an electrical connector for electrically connecting respective electrical contacts of at least two power semiconductor devices (30, 42) and serving as an output connector. The conductive element improving heat transfer from the power semiconductor devices through the top of the module.
(FR)Cette invention concerne un module multipuce comprenant un élément conducteur qui fait office de connecteur électrique entre les contacts électriques respectifs d'au moins deux dispositifs semi-conducteurs et joue le rôle de connecteur de sortie. L'élément conducteur améliore le transfert de chaleur depuis les dispositifs semi-conducteurs par le sommet du module.
Designated States: AE, AG, AL, AM, AT, AU, AZ, BA, BB, BG, BR, BY, BZ, CA, CH, CN, CO, CR, CU, CZ, DE, DK, DM, DZ, EC, EE, ES, FI, GB, GD, GE, GH, GM, HR, HU, ID, IL, IN, IS, JP, KE, KG, KP, KR, KZ, LC, LK, LR, LS, LT, LU, LV, MA, MD, MG, MK, MN, MW, MX, MZ, NI, NO, NZ, OM, PH, PL, PT, RO, RU, SC, SD, SE, SG, SK, SL, TJ, TM, TN, TR, TT, TZ, UA, UG, UZ, VC, VN, YU, ZA, ZM, ZW.
African Regional Intellectual Property Organization (GH, GM, KE, LS, MW, MZ, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HU, IE, IT, LU, MC, NL, PT, RO, SE, SI, SK, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG).
Publication Language: English (EN)
Filing Language: English (EN)