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Machine translation
1. (WO2004008522) METHOD FOR PRODUCING A COMPONENT HAVING SUBMERGED CONNECTING AREAS
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2004/008522    International Application No.:    PCT/EP2003/005859
Publication Date: 22.01.2004 International Filing Date: 04.06.2003
Chapter 2 Demand Filed:    16.02.2004    
IPC:
B81B 7/00 (2006.01), B81C 1/00 (2006.01), H01L 21/98 (2006.01)
Applicants: AUSTRIAMICROSYSTEMS AG [AT/AT]; Schloss Premstätten, A-8141 Unterpremstätten (AT) (For All Designated States Except US).
BRANDL, Manfred [AT/AT]; (AT) (For US Only).
CSERNICSKA, Robert [AT/AT]; (AT) (For US Only).
DRAXLER, Walter [AT/AT]; (AT) (For US Only)
Inventors: BRANDL, Manfred; (AT).
CSERNICSKA, Robert; (AT).
DRAXLER, Walter; (AT)
Agent: EPPING HERMANN FISCHER PATENTANWALTSGESELLSCHAFT MBH; P.O. Box 200734, 80007 München (DE)
Priority Data:
102 32 190.6 16.07.2002 DE
Title (DE) VERFAHREN ZUR HERSTELLUNG EINES BAUELEMENTS MIT TIEFLIEGENDEN ANSCHLUSSFLÄCHEN
(EN) METHOD FOR PRODUCING A COMPONENT HAVING SUBMERGED CONNECTING AREAS
(FR) PROCEDE DE PRODUCTION D'UN COMPOSANT A SURFACES DE CONNEXION PROFONDES
Abstract: front page image
(DE)Zum Freilegen einer tiefliegenden bondbaren Anschlußfläche in einem zumindest zwei miteinander verbundene Substrate umfassenden B auelement wird vorgeschlagen, vor dem Verbinden der beiden Substrate auf der Verbindungsoberfläche des zweiten Substrats Gräben relativ geringer Tiefe vorzusehen. Nach dem Verbinden der beiden Substrate werden den Gräben gegenüberliegende, die Gräben von der Rückseite her öffnende Einschnitte erzeugt. Zwischen zwei Gräben werden die zu entfernenden Ausschnitte definiert.
(EN)In order to expose a submerged bondable connecting area in a component comprising at least two substrates that are joined to one another, trenches of a relatively shallow depth are provided on the joining service of the second substrate before the substrates are joined. After joining both substrates, cuts are made opposite the trenches thereby opening the same from the rear side. The cutouts to be removed are defined between two trenches.
(FR)Afin de dégager une surface de connexion profonde métallisable, dans au moins un composant comprenant au moins deux substrats interconnectés, il est prévu, avant d'interconnecter les deux substrats, de pratiquer des tranchées de profondeur relativement réduite, sur la surface de jonction du second substrat. Après assemblage des deux substrats, des incisions opposées aux tranchées sont pratiquées, de manière à ouvrir lesdites tranchées depuis l'arrière. Les découpes à enlever sont définies entre deux tranchées.
Designated States: AE, AG, AL, AM, AT, AU, AZ, BA, BB, BG, BR, BY, BZ, CA, CH, CN, CO, CR, CU, CZ, DK, DM, DZ, EC, EE, ES, FI, GB, GD, GE, GH, GM, HR, HU, ID, IL, IN, IS, JP, KE, KG, KP, KR, KZ, LC, LK, LR, LS, LT, LU, LV, MA, MD, MG, MK, MN, MW, MX, MZ, NI, NO, NZ, OM, PH, PL, PT, RO, RU, SC, SD, SE, SG, SK, SL, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, YU, ZA, ZM, ZW.
African Regional Intellectual Property Organization (GH, GM, KE, LS, MW, MZ, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HU, IE, IT, LU, MC, NL, PT, RO, SE, SI, SK, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG).
Publication Language: German (DE)
Filing Language: German (DE)