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Machine translation
1. (WO2004007137) METHOD AND DEVICE FOR REMOVAL OF THIN-FILM
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2004/007137    International Application No.:    PCT/JP2003/008749
Publication Date: 22.01.2004 International Filing Date: 10.07.2003
IPC:
B23K 26/06 (2006.01), B23K 26/067 (2006.01), B23K 26/08 (2006.01), B23K 26/36 (2006.01), B23K 26/38 (2006.01)
Applicants: HITACHI ZOSEN CORPORATION [JP/JP]; 7-89, Nanko Kita 1-chome, Suminoe-ku, Osaka-shi, Osaka 559-8559 (JP).
TAKEI ELECTRIC INDUSTRIES CO.,LTD. [JP/JP]; 2617, Eguchi, Kita shigeyasucho, miyakigun, Saga 849-0112 (JP).
SONY CORPORATION [JP/JP]; 7-35, Kita shinagawa 6-chome, Shinagawa-ku, Tokyo 141-0001 (JP)
Inventors: FUKUDA, Naoaki; (JP).
KITAGAWA, Akikazu; (JP).
KATO, Tsuyoshi; (JP).
YAMADA, Minoru; (JP).
TAKEI, Kenji; (JP).
TANIMOTO, Yasunori; (JP).
UKAI, Yasuhiro; (JP).
MUNAKATA, Masaki; (JP)
Agent: MIZOGAMI, Mitsuyoshi; Honmachi-Ide Bldg.2F., 10-4, Utsubohonmachi 1-chome, Nishi-ku, Osaka-shi, Osaka 550-0004 (JP)
Priority Data:
2002-204355 12.07.2002 JP
2003-271635 07.07.2003 JP
Title (EN) METHOD AND DEVICE FOR REMOVAL OF THIN-FILM
(FR) PROCEDE ET DISPOSITIF DE RETRAIT DE FILM MINCE
(JA) 薄膜除去方法及び装置
Abstract: front page image
(EN)A method of removing a thin-film (11) from the surface of a substrate (12) by radiating laser beam (13) onto the surface of the substrate (12) coated with the thin-film (11), comprising the step of radiating the laser beam (13) aslant onto the surface of the substrate (12).
(FR)L'invention concerne un procédé de retrait de film mince (11) de la surface d'un substrat (12) par rayonnent d'un faisceau laser (13) sur la surface du substrat (12) recouvert du film mince (11), consistant à irradier ledit faisceau laser (13) obliquement sur la surface du substrat (12).
(JA)表面に薄膜(11)を処理した基板(12)に対してレーザビーム(13)を照射し、基板(12)表面の薄膜(11)を除去する方法である。前記レーザビーム(13)を、前記基板(12)表面に対して斜め方向から照射する。
Designated States: CN, KR.
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)