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Machine translation
1. (WO2004007105) APPARATUS AND METHOD FOR BACKFILLING A SEMICONDUCTOR WAFER PROCESS CHAMBER
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2004/007105    International Application No.:    PCT/US2003/021641
Publication Date: 22.01.2004 International Filing Date: 10.07.2003
IPC:
C23C 16/44 (2006.01), C23C 16/46 (2006.01), C23C 16/54 (2006.01), H01L 21/00 (2006.01)
Applicants: AVIZA TECHNOLOGY, INC. [US/US]; 440 Kings Village Road, Scotts Valley, CA 95066 (US) (For All Designated States Except US).
TORKAMAN, Amir [IR/US]; (US) (For US Only)
Inventors: TORKAMAN, Amir; (US)
Agent: SWIATEK, Maria, S.; Dorsey & Whitney LLP, 4 Embarcadero Center, Suite 3400, San Francisco, CA 94111 (US)
Priority Data:
60/396,536 15.07.2002 US
60/428,526 22.11.2002 US
Title (EN) APPARATUS AND METHOD FOR BACKFILLING A SEMICONDUCTOR WAFER PROCESS CHAMBER
(FR) APPAREIL ET PROCEDE DE REMPLISSAGE D'UNE CHAMBRE DE TRAITEMENT DE PLAQUETTE A SEMICONDUCTEUR
Abstract: front page image
(EN)Various backfill injectors that provide upflowing gas and have improved uniformity of distribution of gas into the perimeter of the process chamber are provided for use in semiconductor wafer processing apparatus. Suitably optimized backfill trajectories that avoid excessive injection velocity of the purge gas are also provided. The backfill injectors and/or other types of injectors as well as the optimized injection trajectories significantly reduce processing cycle times and improve process uniformity.
(FR)L'invention concerne divers injecteurs de remplissage fournissant un gaz ascendant et possédant une uniformité de répartition du gaz amélioré dans le périmètre de la chambre de traitement, ces injecteurs étant utilisés dans un appareil de traitement de plaquette à semiconducteur. Des trajectoires de remplissage optimisées de façon appropriée empêchant une vitesse d'injection excessive du gaz de purge. Les injecteurs de remplissage et/ou d'autres types d'injecteur, ainsi que les trajectoires d'injection optimisées permettent de réduire de façon significative le temps du cycle de traitement et améliorent l'uniformité de traitement.
Designated States: AE, AG, AL, AM, AT, AU, AZ, BA, BB, BG, BR, BY, BZ, CA, CH, CN, CO, CR, CU, CZ, DE, DK, DM, DZ, EC, EE, ES, FI, GB, GD, GE, GH, GM, HR, HU, ID, IL, IN, IS, JP, KE, KG, KP, KR, KZ, LC, LK, LR, LS, LT, LU, LV, MA, MD, MG, MK, MN, MW, MX, MZ, NI, NO, NZ, OM, PG, PH, PL, PT, RO, RU, SC, SD, SE, SG, SK, SL, SY, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, YU, ZA, ZM, ZW.
African Regional Intellectual Property Organization (GH, GM, KE, LS, MW, MZ, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HU, IE, IT, LU, MC, NL, PT, RO, SE, SI, SK, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG).
Publication Language: English (EN)
Filing Language: English (EN)