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Machine translation
1. (WO2004006628) HYGROSCOPIC MOLDING
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2004/006628    International Application No.:    PCT/JP2003/008574
Publication Date: 15.01.2004 International Filing Date: 07.07.2003
IPC:
H01L 23/26 (2006.01), H01L 51/52 (2006.01)
Applicants: DYNIC CORPORATION [JP/JP]; 26, Nishikyogoku Daimon-cho, Ukyo-ku, Kyoto-shi, Kyoto 615-0812 (JP) (For All Designated States Except US).
UCHIBORI, Teruo [JP/JP]; (JP) (For US Only).
OHYAMA, Kaneto [JP/JP]; (JP) (For US Only).
MIYAZAWA, Kentaro [JP/JP]; (JP) (For US Only).
KAWAGUCHI, Yohei [JP/JP]; (JP) (For US Only).
MAKI, Hidehiko [JP/JP]; (JP) (For US Only).
NAKAJIMA, Yusuke [JP/JP]; (JP) (For US Only)
Inventors: UCHIBORI, Teruo; (JP).
OHYAMA, Kaneto; (JP).
MIYAZAWA, Kentaro; (JP).
KAWAGUCHI, Yohei; (JP).
MAKI, Hidehiko; (JP).
NAKAJIMA, Yusuke; (JP)
Agent: SAEGUSA, Eiji; Kitahama TNK Building, 1-7-1, Doshomachi, Chuo-ku, Osaka-shi, Osaka 541-0045 (JP)
Priority Data:
2002-198922 08.07.2002 JP
2002-214029 23.07.2002 JP
Title (EN) HYGROSCOPIC MOLDING
(FR) MOULAGE HYGROSCOPIQUE
(JA) 吸湿性成形体
Abstract: front page image
(EN)A hygroscopic molding for removing moisture from a sealed atmosphere of organic EL element and thus for inhibiting the occurrence of dark spots, comprising at least one of an amine compound and a heat transfer material (1), a hygroscopic agent (2) and a resin component (3).
(FR)L'invention concerne un moulage hygroscopique servant à absorber l'humidité d'une atmosphère étanche d'un élément organique électroluminescent et, par conséquent, à éliminer l'apparition de points noirs, comprenant au moins un composé aminé, un agent de transfert de chaleur (1), un agent hygroscopique (2) et un composé de résine (3).
(JA)有機EL素子の密閉雰囲気内の水分を除去し、ひいてはダークスポットの発生を抑制するため、1)アミン系化合物及び熱伝導性材料の少なくとも1種、2)吸湿剤及び3)樹脂成分を含有する吸湿性成形体を提供する。
Designated States: AE, AG, AL, AM, AT, AU, AZ, BA, BB, BG, BR, BY, BZ, CA, CH, CN, CO, CR, CU, CZ, DE, DK, DM, DZ, EC, EE, ES, FI, GB, GD, GE, GH, GM, HR, HU, ID, IL, IN, IS, JP, KE, KG, KR, KZ, LC, LK, LR, LS, LT, LU, LV, MA, MD, MG, MK, MN, MW, MX, MZ, NI, NO, NZ, OM, PG, PH, PL, PT, RO, RU, SC, SD, SE, SG, SK, SL, SY, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, YU, ZA, ZM, ZW.
African Regional Intellectual Property Organization (GH, GM, KE, LS, MW, MZ, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HU, IE, IT, LU, MC, NL, PT, RO, SE, SI, SK, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG).
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)