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Pub. No.:    WO/2004/006628    International Application No.:    PCT/JP2003/008574
Publication Date: 15.01.2004 International Filing Date: 07.07.2003
H01L 23/26 (2006.01), H01L 51/52 (2006.01)
Applicants: DYNIC CORPORATION [JP/JP]; 26, Nishikyogoku Daimon-cho, Ukyo-ku, Kyoto-shi, Kyoto 615-0812 (JP) (For All Designated States Except US).
UCHIBORI, Teruo [JP/JP]; (JP) (For US Only).
OHYAMA, Kaneto [JP/JP]; (JP) (For US Only).
MIYAZAWA, Kentaro [JP/JP]; (JP) (For US Only).
KAWAGUCHI, Yohei [JP/JP]; (JP) (For US Only).
MAKI, Hidehiko [JP/JP]; (JP) (For US Only).
NAKAJIMA, Yusuke [JP/JP]; (JP) (For US Only)
Inventors: UCHIBORI, Teruo; (JP).
OHYAMA, Kaneto; (JP).
MIYAZAWA, Kentaro; (JP).
MAKI, Hidehiko; (JP).
NAKAJIMA, Yusuke; (JP)
Agent: SAEGUSA, Eiji; Kitahama TNK Building, 1-7-1, Doshomachi, Chuo-ku, Osaka-shi, Osaka 541-0045 (JP)
Priority Data:
2002-198922 08.07.2002 JP
2002-214029 23.07.2002 JP
(JA) 吸湿性成形体
Abstract: front page image
(EN)A hygroscopic molding for removing moisture from a sealed atmosphere of organic EL element and thus for inhibiting the occurrence of dark spots, comprising at least one of an amine compound and a heat transfer material (1), a hygroscopic agent (2) and a resin component (3).
(FR)L'invention concerne un moulage hygroscopique servant à absorber l'humidité d'une atmosphère étanche d'un élément organique électroluminescent et, par conséquent, à éliminer l'apparition de points noirs, comprenant au moins un composé aminé, un agent de transfert de chaleur (1), un agent hygroscopique (2) et un composé de résine (3).
Designated States: AE, AG, AL, AM, AT, AU, AZ, BA, BB, BG, BR, BY, BZ, CA, CH, CN, CO, CR, CU, CZ, DE, DK, DM, DZ, EC, EE, ES, FI, GB, GD, GE, GH, GM, HR, HU, ID, IL, IN, IS, JP, KE, KG, KR, KZ, LC, LK, LR, LS, LT, LU, LV, MA, MD, MG, MK, MN, MW, MX, MZ, NI, NO, NZ, OM, PG, PH, PL, PT, RO, RU, SC, SD, SE, SG, SK, SL, SY, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, YU, ZA, ZM, ZW.
African Regional Intellectual Property Organization (GH, GM, KE, LS, MW, MZ, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HU, IE, IT, LU, MC, NL, PT, RO, SE, SI, SK, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG).
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)