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Machine translation
1. (WO2004006329) THIN−FILM SUBSTRATE HAVING POST VIA
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2004/006329    International Application No.:    PCT/JP2002/006847
Publication Date: 15.01.2004 International Filing Date: 05.07.2002
IPC:
H01L 21/768 (2006.01), H01L 23/498 (2006.01), H05K 3/46 (2006.01)
Applicants: FUJITSU LIMITED [JP/JP]; 1-1, Kamikodanaka 4-chome, Nakahara-ku, Kawasaki-shi, Kanagawa 211-8588 (JP) (For All Designated States Except US).
KOIDE, Masateru [JP/JP]; (JP) (For US Only).
FUKUNAGA, Naomi [JP/JP]; (JP) (For US Only).
UMEMATSU, Misao [JP/JP]; (JP) (For US Only).
OHSAWA, Satoshi [JP/JP]; (JP) (For US Only).
YAMAMOTO, Tomohisa [JP/JP]; (JP) (For US Only)
Inventors: KOIDE, Masateru; (JP).
FUKUNAGA, Naomi; (JP).
UMEMATSU, Misao; (JP).
OHSAWA, Satoshi; (JP).
YAMAMOTO, Tomohisa; (JP)
Agent: ITOH, Tadahiko; 32nd Floor, Yebisu Garden Place Tower, 20-3, Ebisu 4-chome, Shibuya-ku, Tokyo 150-6032 (JP)
Priority Data:
Title (EN) THIN−FILM SUBSTRATE HAVING POST VIA
(FR) SUBSTRAT À FILM MINCE COMPRENANT UN TROU D'INTERCONNEXION
(JA) ポストビアを有する薄膜基板
Abstract: front page image
(EN)An insulating layer (14) is formed between two wiring layers forming pattern wiring. A post via (15) for signal transmission electrically interconnects the wiring layers. A dummy post via (17) is disposed in a portion where the density of the post vias (15) is lower than that of the other portions in the insulating layer (14). The dummy post via (17) is an isolated post via not connected to a signal transmission circuit. As a result, the distribution density of the post vias in the insulating layer (14) is uniformed to some extent, and the whole insulating layer (14) is polished to a uniform thickness.
(FR)L'invention concerne une couche isolante (14) formée entre deux couches de câblage formant un motif de câblage. Un trou d'interconnexion (15) conçu pour la transmission de signaux interconnecte les couches de câblage. Un trou d'interconnexion fictif (17) est disposé dans une partie ou la densité de trous d'interconnexion (15) est inférieure à celle des autres parties de la couche isolante (14). Le trou d'interconnexion fictif (17) est un trou d'interconnexion isolé qui n'est pas connecté à un circuit de transmission. En conséquence, la densité de distribution des trous d'interconnexion dans la couche isolante (14) est uniformisé jusqu'à un certain point et toute la couche isolante (14) est polie jusqu'à atteindre une épaisseur uniforme.
(JA)not available
Designated States: JP, US.
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)