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Machine translation
1. (WO2004006318) PROCESSING DEVICE AND PROCESSING METHOD
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2004/006318    International Application No.:    PCT/JP2003/008352
Publication Date: 15.01.2004 International Filing Date: 01.07.2003
Chapter 2 Demand Filed:    04.12.2003    
IPC:
H01L 21/00 (2006.01)
Applicants: TOKYO ELECTRON LIMITED [JP/JP]; 3-6, Akasaka 5-chome, Minato-ku, Tokyo 107-8481 (JP) (For All Designated States Except US).
IWASHITA, Mitsuaki [JP/JP]; (JP) (For US Only).
KONISHI, Nobuo [JP/JP]; (JP) (For US Only)
Inventors: IWASHITA, Mitsuaki; (JP).
KONISHI, Nobuo; (JP)
Agent: KANEMOTO, Tetsuo; Kanemoto, Kameya, Hagiwara and Inoue, Shinjuku Akebonobashi Building, 1-12, Sumiyoshi-cho, Shinjuku-ku, Tokyo 162-0065 (JP)
Priority Data:
2002-198353 08.07.2002 JP
Title (EN) PROCESSING DEVICE AND PROCESSING METHOD
(FR) DISPOSITIF ET PROCEDE DE TRAITEMENT
(JA) 処理装置及び処理方法
Abstract: front page image
(EN)A processing device and a processing method for applying a specified processing to a substrate such as a wafer to prevent a hard mask from peeling off during a polishing processing performed later, the processing device comprising a sloped part so that a film thickness can be reduced toward the outer peripheral parts and the end parts of the substrate having a film formed thereon.
(FR)L'invention concerne un dispositif et un procédé de traitement destinés à appliquer un traitement spécifié à un substrat, tel qu'une tranche semi-conductrice, afin d'empêcher le dépelliculage d'un masque dur lors d'un traitement de polissage réalisé ultérieurement, le dispositif de traitement comprenant une partie inclinée de façon qu'une épaisseur de film soit réduite en direction des parties périphériques extérieures et des parties d'extrémités du substrat sur lequel le film est formé.
(JA)本発明は,後に行われる研磨処理時にハードマスク等の剥離を防止するために,予めウェハ等の基板に所定の処理を施すことを目的としている。  本発明では,膜が形成されている基板の外周部,端部に近づくにつれて膜厚が薄くなるような傾斜部を形成する。
Designated States: AE, AG, AL, AM, AT, AU, AZ, BA, BB, BG, BR, BY, BZ, CA, CH, CN, CO, CR, CU, CZ, DE, DK, DM, DZ, EC, EE, ES, FI, GB, GD, GE, GH, GM, HR, HU, ID, IL, IN, IS, KE, KG, KP, KR, KZ, LC, LK, LR, LS, LT, LU, LV, MA, MD, MG, MK, MN, MW, MX, MZ, NO, NZ, OM, PH, PL, PT, RO, RU, SD, SE, SG, SK, SL, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, YU, ZA, ZM, ZW.
African Regional Intellectual Property Organization (GH, GM, KE, LS, MW, MZ, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HU, IE, IT, LU, MC, NL, PT, RO, SE, SI, SK, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG).
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)