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1. (WO2004006305) ELECTROLESS PLATING APPARATUS AND POST-ELECTROLESS PLATING CLEANING METHOD
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2004/006305    International Application No.:    PCT/JP2003/008604
Publication Date: 15.01.2004 International Filing Date: 07.07.2003
IPC:
B08B 1/04 (2006.01), C23C 18/16 (2006.01), H01L 21/00 (2006.01)
Applicants: EBARA CORPORATION [JP/JP]; 11-1, Haneda Asahi-cho, Ohta-ku, Tokyo 144-8510 (JP) (For All Designated States Except US).
KATAKABE, Ichiro [JP/JP]; (JP) (For US Only).
INOUE, Yuki [JP/JP]; (JP) (For US Only).
WANG, Xinming [CN/JP]; (JP) (For US Only).
TAKAGI, Daisuke [JP/JP]; (JP) (For US Only)
Inventors: KATAKABE, Ichiro; (JP).
INOUE, Yuki; (JP).
WANG, Xinming; (JP).
TAKAGI, Daisuke; (JP)
Agent: WATANABE, Isamu; GOWA Nishi-Shinjuku 4F, 5-8, Nishi-Shinjuku 7-chome, Shinjuku-ku, Tokyo 160-0023 (JP)
Priority Data:
2002-197684 05.07.2002 JP
2003-24944 31.01.2003 JP
Title (EN) ELECTROLESS PLATING APPARATUS AND POST-ELECTROLESS PLATING CLEANING METHOD
(FR) APPAREIL DE DEPOT AUTOCATALYTIQUE ET PROCEDE DE NETTOYAGE APRES UN DEPOT AUTOCATALYTIQUE
Abstract: front page image
(EN)There are provided an electroless plating apparatus and a post-electroless plating cleaning method which can remove Co or Ni particles, produced upon electroless plating onto Cu interconnects of an electronic circuit substrate and remaining on a silicon oxide film as an interlevel dielectric, without exerting an adverse influence on the Cu interconnects. The electroless plating apparatus for carrying out electroless plating of the surface of interconnects formed in a surface of an electronic circuit substrate having fine circuit patterns of conductive metal interconnects, includes: a substrate transfer device (62, 76, 86); a loading station (58) disposed in association with the substrate transfer device; at least one electroless plating cell (82) disposed in association with the substrate transfer device; and a scrub cleaning device (66a) and/or a solution cleaning device (66c) disposed in association with the substrate transfer device.
(FR)L'invention concerne un appareil de dépôt autocatalytique et un procédé de nettoyage après un dépôt autocatalytique permettant d'enlever les particules de Co ou de Ni produites lors d'un dépôt autocatalytique sur les interconnexions en Cu d'un substrat de circuit électronique et restant sur un film d'oxyde de silicium sous forme de diélectrique interniveau sans exercer d'influence sur lesdites interconnexions en Cu. L'appareil de dépôt autocatalytique permettant d'effectuer un dépôt autocatalytique sur la surface d'interconnexions formées sur la surface d'un substrat de circuit électronique présentant de fins motifs de circuit d'interconnexions métalliques conductrices comprend: un dispositif de transfert de substrat (62, 76, 86); une station de chargement (58) associée au dispositif de transfert de substrat; au moins une cellule de dépôt autocatalytique (82) également associée au dispositif de transfert de substrat; un dispositif de nettoyage par brossage (66a) et/ou un dispositif de nettoyage (66c) à l'aide d'une solution associé audit dispositif de transfert de substrat.
Designated States: AE, AG, AL, AM, AT, AU, AZ, BA, BB, BG, BR, BY, BZ, CA, CH, CN, CO, CR, CU, CZ, DE, DK, DM, DZ, EC, EE, ES, FI, GB, GD, GE, GH, GM, HR, HU, ID, IL, IN, IS, KE, KG, KP, KR, KZ, LC, LK, LR, LS, LT, LU, LV, MA, MD, MG, MK, MN, MW, MX, MZ, NI, NO, NZ, OM, PG, PH, PL, PT, RO, RU, SC, SD, SE, SG, SK, SL, SY, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, YU, ZA, ZM, ZW.
African Regional Intellectual Property Organization (GH, GM, KE, LS, MW, MZ, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HU, IE, IT, LU, MC, NL, PT, RO, SE, SI, SK, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG).
Publication Language: English (EN)
Filing Language: English (EN)