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Machine translation
1. (WO2004005030) PRINTHEAD
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2004/005030    International Application No.:    PCT/US2003/020730
Publication Date: 15.01.2004 International Filing Date: 02.07.2003
Chapter 2 Demand Filed:    02.02.2004    
IPC:
B41J 2/045 (2006.01), B41J 2/055 (2006.01), B41J 2/14 (2006.01)
Applicants: SPECTRA, INC. [US/US]; 101 Etna Road, Lebanon, NH 03766-1422 (US) (For All Designated States Except US).
BIBL, Andreas [US/US]; (US) (For US Only).
HIGGINSON, John, A. [US/US]; (US) (For US Only).
HOISINGTON, Paul, A. [US/US]; (US) (For US Only).
GARDNER, Deane, A. [US/US]; (US) (For US Only).
HASENBEIN, Robert, A. [US/US]; (US) (For US Only).
BIGGS, Melvin, L. [US/US]; (US) (For US Only).
MOYNIHAN, Edward, R. [US/US]; (US) (For US Only)
Inventors: BIBL, Andreas; (US).
HIGGINSON, John, A.; (US).
HOISINGTON, Paul, A.; (US).
GARDNER, Deane, A.; (US).
HASENBEIN, Robert, A.; (US).
BIGGS, Melvin, L.; (US).
MOYNIHAN, Edward, R.; (US)
Agent: GAGEL, John, J.; Fish & Richardson P.C., 225 Franklin Street, Boston, MA 02110-2804 (US)
Priority Data:
10/189,947 03.07.2002 US
Title (EN) PRINTHEAD
(FR) TETES D'IMPRESSION
Abstract: front page image
(EN)A printhead having a monolithic semiconductor body (26) which defines a pressure chamber (33), a nozzle flow path (66) and a nozzle opening (22). A piezoelectric actuator (28) is associated with the pressure chamber, it includes a piezoelectric layer 76 having a thickness of about 50 microns or less. The semiconductorbody also defines a filter/impedance feature (32) having a plurality of flow openings. The semiconductor body is preferably a polished SOI wafer. In another aspect, the invention features a printhead with a piezoelectric byer having a surface Ra of about 0,05 microns or less, or at least one surface including a void-filler material.
(FR)L'invention porte sur des têtes d'impression à jet d'encre, et sur des composants de têtes d'impression.
Designated States: AE, AG, AL, AM, AT, AU, AZ, BA, BB, BG, BR, BY, BZ, CA, CH, CN, CO, CR, CU, CZ, DE, DK, DM, DZ, EC, EE, ES, FI, GB, GD, GE, GH, GM, HR, HU, ID, IL, IN, IS, JP, KE, KG, KP, KR, KZ, LC, LK, LR, LS, LT, LU, LV, MA, MD, MG, MK, MN, MW, MX, MZ, NI, NO, NZ, OM, PG, PH, PL, PT, RO, RU, SC, SD, SE, SG, SK, SL, SY, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, YU, ZA, ZM, ZW.
African Regional Intellectual Property Organization (GH, GM, KE, LS, MW, MZ, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HU, IE, IT, LU, MC, NL, PT, RO, SE, SI, SK, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG).
Publication Language: English (EN)
Filing Language: English (EN)