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1. WO2004004434 - MULTILAYER STRIPLINE RADIO FREQUENCY CIRCUITS AND INTERCONNECTION METHODS

Publication Number WO/2004/004434
Publication Date 08.01.2004
International Application No. PCT/US2003/016479
International Filing Date 23.05.2003
IPC
H01P 3/08 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
PWAVEGUIDES; RESONATORS, LINES OR OTHER DEVICES OF THE WAVEGUIDE TYPE
3Waveguides; Transmission lines of the waveguide type
02with two longitudinal conductors
08Microstrips; Strip lines
H05K 1/02 2006.01
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1Printed circuits
02Details
H05K 3/32 2006.01
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3Apparatus or processes for manufacturing printed circuits
30Assembling printed circuits with electric components, e.g. with resistor
32electrically connecting electric components or wires to printed circuits
H05K 3/46 2006.01
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3Apparatus or processes for manufacturing printed circuits
46Manufacturing multi-layer circuits
CPC
H01P 3/085
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
PWAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
3Waveguides; Transmission lines of the waveguide type
02with two longitudinal conductors
08Microstrips; Strip lines
085Triplate lines
H01P 3/088
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
PWAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
3Waveguides; Transmission lines of the waveguide type
02with two longitudinal conductors
08Microstrips; Strip lines
088Stacked transmission lines
H05K 1/0237
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1Printed circuits
02Details
0213Electrical arrangements not otherwise provided for
0237High frequency adaptations
H05K 2201/09509
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
2201Indexing scheme relating to printed circuits covered by H05K1/00
09Shape and layout
09209Shape and layout details of conductors
095Conductive through-holes or vias
09509Blind vias, i.e. vias having one side closed
H05K 2201/09536
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
2201Indexing scheme relating to printed circuits covered by H05K1/00
09Shape and layout
09209Shape and layout details of conductors
095Conductive through-holes or vias
09536Buried plated through-holes, i.e. plated through-holes formed in a core before lamination
H05K 2201/096
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
2201Indexing scheme relating to printed circuits covered by H05K1/00
09Shape and layout
09209Shape and layout details of conductors
095Conductive through-holes or vias
096Vertically aligned vias, holes or stacked vias
Applicants
  • RAYTHEON COMPANY [US]/[US]
Inventors
  • PUZELLA, Angelo
  • CROWDER, Joseph, M.
  • DUPUIS, Patricia, S.
  • FALLICA, Michael, C.
Agents
  • DURKEE, Paul, D.
Priority Data
10/185,85327.06.2002US
Publication Language English (EN)
Filing Language English (EN)
Designated States
Title
(EN) MULTILAYER STRIPLINE RADIO FREQUENCY CIRCUITS AND INTERCONNECTION METHODS
(FR) CIRCUITS RADIOFREQUENCE MULTICOUCHE A LIGNES A MICRORUBAN ET PROCEDES D'INTERCONNEXION
Abstract
(EN)
A multi-layer stripline assembly (70) interconnection includes a first stripline sub-assembly (10a) having a first surface and a first plurality of vias (20) disposed in the first surface adapted to receive a plurality of solid metal balls (52) .The interconnection further includes a second stripline sub-assembly (10B) having a second plurality of vias (20') disposed in the first surface of the second sub-assembly adapted to be aligned with the first plurality of vias (20) . Reflowed solder (60) is wetted to the second plurality of vias (20') and to the corresponding plurality of solid metal balls (52).
(FR)
L'invention concerne une interconnexion d'ensemble (70) de lignes à microruban comprenant un premier sous-ensemble (10a) à ligne à microruban doté d'une première surface et d'une première pluralité de trous d'interconnexion (20) disposés sur ladite première surface conçue pour recevoir une pluralité de billes métalliques (52) pleines. L'interconnexion comprend également un second sous-ensemble (10B) à ligne à microruban dotée d'une seconde pluralité de trous d'interconnexion (20') disposés sur la première surface du second sous-ensemble conçue pour être alignée avec la première pluralité de trous d'interconnexion (20). La brasure par refusion (60) s'écoule dans la seconde pluralité de trous d'interconnexion (20') et sur la pluralité de billes métalliques (52) pleines correspondantes.
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