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1. (WO2004003987) CONTAMINATION REMOVER
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2004/003987    International Application No.:    PCT/JP2003/007768
Publication Date: 08.01.2004 International Filing Date: 19.06.2003
IPC:
B24B 7/04 (2006.01), B08B 1/04 (2006.01), B24B 27/00 (2006.01), B24B 37/00 (2012.01), B24B 37/20 (2012.01), B24B 37/24 (2012.01), B24B 57/02 (2006.01), B24B 9/06 (2006.01), B24D 7/10 (2006.01), H01L 21/00 (2006.01), H01L 21/304 (2006.01)
Applicants: DISCO CORPORATION [JP/JP]; 14-3, Higashi Kojiya 2-chome, Ota-ku, Tokyo 144-8650 (JP) (For All Designated States Except US).
ARAI, Kazuhisa [JP/JP]; (JP) (For US Only).
MITSUI, Yshinori [JP/JP]; (JP) (For US Only).
HAYASAKA, Hideki [JP/JP]; (JP) (For US Only)
Inventors: ARAI, Kazuhisa; (JP).
MITSUI, Yshinori; (JP).
HAYASAKA, Hideki; (JP)
Agent: ONO, Hisazumi; Nippon Shuzo bldg., 1-21, Nishi-Shimbashi 1-chome, Minato-ku, Tokyo 105-0003 (JP)
Priority Data:
2002-186535 26.06.2002 JP
Title (EN) CONTAMINATION REMOVER
(FR) APPAREIL DE DECONTAMINATION
(JA) コンタミネーション除去装置
Abstract: front page image
(EN)A contamination remover for removing contamination adhered to the peripheral portion of the back or front surface and the edge of a semiconductor wafer, comprising a holding means having a rotary table for holding a semiconductor wafer and a rotary driving means for driving the rotary table, a peripheral portion abrading means having a ring-shaped or disk-shaped first abrasive pad whose end face acts on the peripheral portion of the upper surface of the semiconductor wafer held on the rotary table, an edge abrading means having a cylindrical second abrasive pad whose curved surface acts on the edge of the semiconductor wafer held on the rotary table, and an abrasive liquid supply means for supplying abrasive liquid on the upper surface of semiconductor wafer held on the rotary table.
(FR)La présente invention concerne un appareil de décontamination permettant d'éliminer la contamination collée sur la partie périphérique de la surface arrière ou avant et sur le bord d'une plaquette semi-conductrice. Ledit appareil de décontamination comprend un dispositif de retenue présentant une table rotative permettant de retenir une plaquette semi-conductrice et un dispositif d'entraînement rotatif permettant d'entraîner la table rotative, un dispositif d'abrasion de partie périphérique présentant un premier tampon abrasif en forme d'anneau ou de disque dont la face d'extrémité agit sur la partie périphérique de la surface supérieure de la plaquette semi-conductrice retenue sur la table rotative, un dispositif d'abrasion de bord présentant un second tampon abrasif cylindrique dont la surface incurvée agit sur le bord de la plaquette semi-conductrice retenue sur la table rotative, et une plaquette d'alimentation en liquide abrasif permettant d'amener du liquide abrasif sur la surface supérieure de plaquette semi-conductrice retenue sur la table rotative.
(JA)半導体ウエーハの表面外縁部または裏面外縁部および外周面に付着したコンタミネーションを除去するためのコンタミネーション除去装置であって、 半導体ウエハを保持する回転テーブルと該回転テーブルを回転駆動する回転駆動手段とを備えた保持手段と、該回転テーブル上に保持された半導体ウエーハの上面外縁部に端面が作用するリング状または円板状の第1の研磨パッドを備えた外縁部研磨手段と、回転テーブル上に保持された半導体ウエーハの外周面に外周面が作用するロール状の第2の研磨パッドを備えた外周面研磨手段と、回転テーブル上に保持された半導体ウエーハの上面に研磨液を供給する研磨液供給手段とを具備している。
Designated States: AE, AG, AL, AM, AT, AU, AZ, BA, BB, BG, BR, BY, BZ, CA, CH, CN, CO, CR, CU, CZ, DE, DK, DM, DZ, EC, EE, ES, FI, GB, GD, GE, GH, GM, HR, HU, ID, IL, IN, IS, KE, KG, KP, KR, KZ, LC, LK, LR, LS, LT, LU, LV, MA, MD, MG, MK, MN, MW, MX, MZ, NI, NO, NZ, OM, PH, PL, PT, RO, RU, SC, SD, SE, SG, SK, SL, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, YU, ZA, ZM, ZW.
African Regional Intellectual Property Organization (GH, GM, KE, LS, MW, MZ, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HU, IE, IT, LU, MC, NL, PT, RO, SE, SI, SK, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG).
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)