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1. (WO2004003974) COMPOSITE HEAT SINK WITH METAL BASE AND GRAPHITE FINS
Latest bibliographic data on file with the International Bureau   

Pub. No.: WO/2004/003974 International Application No.: PCT/US2003/020588
Publication Date: 08.01.2004 International Filing Date: 27.06.2003
Chapter 2 Demand Filed: 23.01.2004
IPC:
H01L 23/367 (2006.01) ,H01L 23/373 (2006.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23
Details of semiconductor or other solid state devices
34
Arrangements for cooling, heating, ventilating or temperature compensation
36
Selection of materials, or shaping, to facilitate cooling or heating, e.g. heat sinks
367
Cooling facilitated by shape of device
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23
Details of semiconductor or other solid state devices
34
Arrangements for cooling, heating, ventilating or temperature compensation
36
Selection of materials, or shaping, to facilitate cooling or heating, e.g. heat sinks
373
Cooling facilitated by selection of materials for the device
Applicants:
GRAFTECH INC. [US/US]; Brandywine West 1521 Concord Pike, Suite 301 Wilmington, DE 19803, US
Inventors:
GETZ, George, Jr.; US
FRASTACI, Michael; US
Agent:
CARTIGLIA, James, R.; Waddey & Patterson, P.C. Suite 2020 414 Union Street Nashville, TN 37219, US
Priority Data:
10/184,84128.06.2002US
Title (EN) COMPOSITE HEAT SINK WITH METAL BASE AND GRAPHITE FINS
(FR) DISSIPATEUR THERMIQUE COMPOSITE COMPRENANT UNE BASE METALLIQUE ET DES AILETTES DE GRAPHITE
Abstract:
(EN) A composite heat sink apparatus includes a metal base which has a thermal conductivity of at least about 200 W/m0K. The metal base is preferably constructed either of copper of aluminum. The heat sink apparatus further includes a plurality of fins attached to the base, the fins being constructed of anisotropic graphite material having a direction of relatively high thermal conductivity perpendicular to the base.
(FR) L'invention concerne un dispositif dissipateur thermique composite qui comprend une base métallique ayant une conductivité thermique d'au moins 200 W/m°K. Cette base métallique est de préférence réalisée en cuivre ou en aluminium. Le dispositif dissipateur thermique selon l'invention comprend également une pluralité d'ailettes reliées à la base et réalisées dans un matériau graphite anisotrope ayant une direction de conductivité thermique relativement élevée perpendiculaire à la base.
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Designated States: AE, AG, AL, AM, AT, AU, AZ, BA, BB, BG, BR, BY, BZ, CA, CH, CN, CO, CR, CU, CZ, DE, DK, DM, DZ, EC, EE, ES, FI, GB, GD, GE, GH, GM, HR, HU, ID, IL, IN, IS, JP, KE, KG, KP, KR, KZ, LC, LK, LR, LS, LT, LU, LV, MA, MD, MG, MK, MN, MW, MX, MZ, NO, NZ, OM, PH, PL, PT, RO, RU, SC, SD, SE, SG, SK, SL, TJ, TM, TN, TR, TT, TZ, UA, UG, UZ, VC, VN, YU, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (GH, GM, KE, LS, MW, MZ, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (EPO) (AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HU, IE, IT, LU, MC, NL, PT, RO, SE, SI, SK, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG)
Publication Language: English (EN)
Filing Language: English (EN)