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Machine translation
1. (WO2004002705) DEVICE AND METHOD FOR SCRIBING SUBSTRATE OF BRITTLE MATERIAL
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2004/002705    International Application No.:    PCT/JP2003/008158
Publication Date: 08.01.2004 International Filing Date: 26.06.2003
Chapter 2 Demand Filed:    08.12.2003    
IPC:
B23K 26/08 (2006.01), B23K 26/40 (2006.01), B28D 1/22 (2006.01), B28D 5/00 (2006.01), C03B 33/03 (2006.01), C03B 33/09 (2006.01)
Applicants: MITSUBOSHI DIAMOND INDUSTRIAL CO.,LTD. [JP/JP]; 2-12-12 Minami-Kaneden, Suita-city, Osaka 564-0044 (JP) (For All Designated States Except US).
OTODA, Kenji [JP/JP]; (JP) (For US Only).
NISHIO, Yoshitaka [JP/JP]; (JP) (For US Only)
Inventors: OTODA, Kenji; (JP).
NISHIO, Yoshitaka; (JP)
Agent: YAMAMOTO, Shusaku; Fifteenth Floor, Crystal Tower, 2-27, Shiromi 1-chome,, Chuo-ku, Osaka-shi, Osaka 540-6015 (JP)
Priority Data:
2002-192707 01.07.2002 JP
Title (EN) DEVICE AND METHOD FOR SCRIBING SUBSTRATE OF BRITTLE MATERIAL
(FR) DISPOSITIF ET PROCEDE PERMETTANT DE TRACER DES RAYURES SUR UN SUBSTRAT D'UN MATERIAU FRIABLE
(JA) 脆性材料基板のスクライブ装置及びスクライブ方法
Abstract: front page image
(EN)A method for scribing a substrate of a brittle material, comprising the step of moving a laser spot so as to become slower than a scribe line forming speed or be temporarily stopped at the end part of the substrate of the brittle material, whereby triggers (cutouts) can be formed without using a scribing cutter such as a cutter wheel and subsequently the substrate of the brittle material can be scribed.
(FR)L'invention porte sur un procédé permettant de tracer des rayures sur un substrat d'un matériau friable. Ce procédé consiste à déplacer une tache laser de manière à ce qu'elle devienne plus lente qu'une vitesse de formation de ligne à rayure ou à s'arrêter temporairement au niveau de la partie d'extrémité du substrat du matériau friable, ce qui permet de former des rainures sans utiliser un instrument de coupe à rayure tel qu'une molette et, par conséquent, de tracer des rayures sur le substrat du matériau poreux.
(JA) レーザスポットを脆性材料基板端部において、スクライブラインを形成中の速度よりも遅くなるように、または一旦停止するように移動させる。これにより、カッターホイール等のスクライブ用カッターを用いることなく、トリガー(切り目)を形成し、引き続き脆性材料基板のスクライブを行うことができる。
Designated States: AE, AG, AL, AM, AT, AU, AZ, BA, BB, BG, BR, BY, BZ, CA, CH, CN, CO, CR, CU, CZ, DE, DK, DM, DZ, EC, EE, ES, FI, GB, GD, GE, GH, GM, HR, HU, ID, IL, IN, IS, JP, KE, KG, KP, KR, KZ, LC, LK, LR, LS, LT, LU, LV, MA, MD, MG, MK, MN, MW, MX, MZ, NI, NO, NZ, OM, PG, PH, PL, PT, RO, RU, SC, SD, SE, SG, SK, SL, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, YU, ZA, ZM, ZW.
African Regional Intellectual Property Organization (GH, GM, KE, LS, MW, MZ, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HU, IE, IT, LU, MC, NL, PT, RO, SE, SI, SK, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG).
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)