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1. (WO2003094203) DIRECT-CONNECT SIGNALING SYSTEM
Latest bibliographic data on file with the International Bureau   

Pub. No.: WO/2003/094203 International Application No.: PCT/US2003/013524
Publication Date: 13.11.2003 International Filing Date: 29.04.2003
IPC:
H01L 23/498 (2006.01) ,H05K 3/22 (2006.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23
Details of semiconductor or other solid state devices
48
Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads or terminal arrangements
488
consisting of soldered or bonded constructions
498
Leads on insulating substrates
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3
Apparatus or processes for manufacturing printed circuits
22
Secondary treatment of printed circuits
Applicants:
SILICON PIPE, INC. [US/US]; 1299 Parkmoor Avenue San Jose, CA 95126-3448, US
Inventors:
FJELSTAD, Joseph, C.; US
SEGARAM, Para, K.; US
HABA, Belgacem; US
Agent:
SHEA, Ronald R.; 6244 Royal Oak Court San Jose, CA 95123, US
Priority Data:
60/376,48229.04.2002US
60/400,18031.07.2002US
Title (EN) DIRECT-CONNECT SIGNALING SYSTEM
(FR) SYSTÈME DE SIGNALISATION À CONNEXION DIRECTE
Abstract:
(EN) A direct-connect signaling system (200) including a printed circuit board (205) and first (201A) and second (201B) integrated circuit packages disposed on the printed circuit board. A plurality of electric signal conductors (203) extend between the first and the second integrated circuit packages suspended above the printed circuit board.
(FR) Système de signalisation à connexion directe comprenant une carte à circuit imprimé et un premier et un deuxième boîtiers de circuit intégré placés sur la carte. Une pluralité de conducteurs de signal électrique s'étendant entre les premier et deuxième boîtiers de circuit intégré sont suspendus au-dessus de la carte à circuit imprimé.
front page image
Designated States: AE, AG, AL, AM, AT, AU, AZ, BA, BB, BG, BR, BY, BZ, CA, CH, CN, CO, CR, CU, CZ, DE, DK, DM, DZ, EC, EE, ES, FI, GB, GD, GE, GH, GM, HR, HU, ID, IL, IN, IS, JP, KE, KG, KP, KR, KZ, LC, LK, LR, LS, LT, LU, LV, MA, MD, MG, MK, MN, MW, MX, MZ, NO, NZ, OM, PH, PL, PT, RO, RU, SD, SE, SG, SK, SL, TJ, TM, TN, TR, TT, TZ, UA, UG, UZ, VN, YU, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (GH, GM, KE, LS, MW, MZ, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (EPO) (AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HU, IE, IT, LU, MC, NL, PT, RO, SE, SI, SK, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG)
Publication Language: English (EN)
Filing Language: English (EN)