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1. (WO2003079434) SEMICONDUCTOR DEVICE HAVING A WIRE BOND PAD AND METHOD THEREFOR

Pub. No.:    WO/2003/079434    International Application No.:    PCT/US2003/007783
Publication Date: Sep 25, 2003 International Filing Date: Mar 12, 2003
IPC: H01L 23/485
Applicants: FREESCALE SEMICONDUCTOR, INC.
Inventors: DOWNEY, Susan, H.
MILLER, James, W.
HALL, Geoffrey, B.
Title: SEMICONDUCTOR DEVICE HAVING A WIRE BOND PAD AND METHOD THEREFOR
Abstract:
An integrated circuit (50) has a wire bond pad (53). The wire bond pad (53) is formed on a passivation layer (18) over active circuitry (26) and/or electrical interconnect layers (24) of the integrated circuit (50). The wire bond pad (53) is connected to a plurality of final metal layer portions (51, 52). The plurality of final metal layer portions (51, 52) are formed in a final interconnect layer of the interconnect layers (24). In one embodiment, the bond pad (53) is formed from aluminum and the final metal layer pads are formed from copper. The wire bond pad (53) allows routing of conductors in a final metal layer (28) directly underlying the bond pad (53), thus allowing the surface area of the semiconductor die to be reduced.