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1. (WO2003073492) METHOD FOR PROCESSING SUBSTRATE
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2003/073492    International Application No.:    PCT/JP2003/002272
Publication Date: 04.09.2003 International Filing Date: 27.02.2003
Chapter 2 Demand Filed:    30.07.2003    
IPC:
H01L 21/28 (2006.01), H01L 21/314 (2006.01)
Applicants: TOKYO ELECTRON LIMITED [JP/JP]; 3-6, Akasaka 5-Chome, Minato-Ku, Tokyo 107-8481 (JP) (For All Designated States Except US).
SASAKI, Masaru [JP/JP]; (JP) (For US Only).
SUGAWARA, Takuya [JP/JP]; (JP) (For US Only).
MATSUYAMA, Seiji [JP/JP]; (JP) (For US Only)
Inventors: SASAKI, Masaru; (JP).
SUGAWARA, Takuya; (JP).
MATSUYAMA, Seiji; (JP)
Agent: ITOH, Tadahiko; 32nd Floor, Yebisu Garden Place Tower, 20-3, Ebisu 4-chome, Shibuya-ku, Tokyo 150-6032 (JP)
Priority Data:
2002-51746 27.02.2002 JP
Title (EN) METHOD FOR PROCESSING SUBSTRATE
(FR) PROCEDE DE TRAITEMENT DE SUBSTRAT
Abstract: front page image
(EN)A method for processing a substrate, which comprises a step of nitriding the surface of an oxide film present on a silicon substrate through supplying nitrogen in a radical state to the surface, to form an oxynitride film, and then a step of supplying oxygen in a radical state to the surface of the oxynitride film.
(FR)L'invention concerne un procédé de traitement de substrat consistant à réaliser une nitruration de la surface d'un film d'oxyde, présent sur un substrat de silicium, par action d'azote radicalaire sur la surface, donnant lieu à la formation d'un film d'oxynitrure, puis par traitement de la surface du film d'oxynitrure au moyen d'oxygène radicalaire.
Designated States: AE, AG, AL, AM, AT, AU, AZ, BA, BB, BG, BR, BY, BZ, CA, CH, CN, CO, CR, CU, CZ, DE, DK, DM, DZ, EC, EE, ES, FI, GB, GD, GE, GH, GM, HR, HU, ID, IL, IN, IS, JP, KE, KG, KP, KR, KZ, LC, LK, LR, LS, LT, LU, LV, MA, MD, MG, MK, MN, MW, MX, MZ, NO, NZ, OM, PH, PL, PT, RO, RU, SC, SD, SE, SG, SK, SL, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, YU, ZA, ZM, ZW.
African Regional Intellectual Property Organization (GH, GM, KE, LS, MW, MZ, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HU, IE, IT, LU, MC, NL, PT, SE, SI, SK, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG).
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)