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Machine translation
1. (WO2003063248) SEMICONDUCTOR DIE PACKAGE WITH SEMICONDUCTOR DIE HAVING SIDE ELECTRICAL CONNECTION
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2003/063248    International Application No.:    PCT/US2003/002070
Publication Date: 31.07.2003 International Filing Date: 21.01.2003
IPC:
H01L 21/768 (2006.01), H01L 23/48 (2006.01), H01L 23/485 (2006.01), H01L 23/498 (2006.01)
Applicants: FAIRCHILD SEMICONDUCTOR CORPORATION [US/US]; 82 Running Hill Road, MS 35-4E, South Portland, ME 04106 (US) (For All Designated States Except US).
ESTACIO, Maria, Cristina, B. [PH/PH]; (PH) (For US Only)
Inventors: ESTACIO, Maria, Cristina, B.; (PH)
Agent: JEWIK, Patrick, R.; Townsend and Townsend and Crew LLP, Two Embarcadero Center, 8th Floor, San Francisco, CA 94111 (US)
Priority Data:
60/351,587 22.01.2002 US
10/346,682 17.01.2003 US
Title (EN) SEMICONDUCTOR DIE PACKAGE WITH SEMICONDUCTOR DIE HAVING SIDE ELECTRICAL CONNECTION
(FR) BOITIER DE SEMI-CONDUCTEUR AVEC DE SEMI-CONDUCTEUR A CONNEXION ELECTRIQUE LATERALE
Abstract: front page image
(EN)A semiconductor die package is disclosed. In one embodiment, the semiconductor die package includes a circuit substrate including a conductive region. A semiconductor die is on the circuit substrate. The semiconductor die includes an edge and a recess at the edge. A solder joint couples the semiconductor die and the conductive region through the recess.
(FR)La présente invention concerne un boîtier de semi-conducteur. Dans un mode de réalisation, le boîtier de semi-conducteur comporte un substrat de circuit comprenant une région conductrice. Le dé semi-conducteur est disposé sur le substrat de circuit. Le dé semi-conducteur comprend une tranche et un évidement au niveau de la tranche. Un joint à brasure relie le dé semi-conducteur et la région conductrice à travers l'évidement.
Designated States: AE, AG, AL, AM, AT, AU, AZ, BA, BB, BG, BR, BY, BZ, CA, CH, CN, CO, CR, CU, CZ, DE, DK, DM, DZ, EC, EE, ES, FI, GB, GD, GE, GH, GM, HR, HU, ID, IL, IN, IS, JP, KE, KG, KP, KR, KZ, LC, LK, LR, LS, LT, LU, LV, MA, MD, MG, MK, MN, MW, MX, MZ, NO, NZ, OM, PH, PL, PT, RO, RU, SC, SD, SE, SG, SI, SK, SL, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, YU, ZA, ZM, ZW.
African Regional Intellectual Property Organization (GH, GM, KE, LS, MW, MZ, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, IE, IT, LU, MC, NL, PT, SE, SK, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG).
Publication Language: English (EN)
Filing Language: English (EN)