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1. (WO2003063243) THIN FILMS, STRUCTURES HAVING THIN FILMS, AND METHODS OF FORMING THIN FILMS

Pub. No.:    WO/2003/063243    International Application No.:    PCT/US2003/002106
Publication Date: Jul 31, 2003 International Filing Date: Jan 24, 2003
IPC: H01L 21/285
H01L 21/768
H01L 23/532
Applicants: HONEYWELL INTERNATIONAL INC.
LEE, Eal, H.
THOMAS, Michael, E.
Inventors: LEE, Eal, H.
THOMAS, Michael, E.
Title: THIN FILMS, STRUCTURES HAVING THIN FILMS, AND METHODS OF FORMING THIN FILMS
Abstract:
The invention described herein relates to new titanium-comprising materials which can be utilized for forming titanium alloy barrier layers for Cu applications. Titanium alloy sputtering targets can be reactively sputtered in a nitrogen-comprising sputtering gas atmosphere to from titanium alloy nitride film, or alternatively in a nitrogen-comprising and oxygen-comprising atmosphere to form titanium alloy oxygen nitrogen thin film. The thin films formed in accordance with the present invention can contain a non-columnar grain structure, low electrical resistivity, high chemical stability, and barrier layer properties comparable or exceeding those of TaN.