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Machine translation
1. (WO2003061896) SOLDER ALLOY AND SOLDERED JOINT
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2003/061896    International Application No.:    PCT/JP2002/000390
Publication Date: 31.07.2003 International Filing Date: 21.01.2002
IPC:
B23K 35/02 (2006.01), B23K 35/26 (2006.01), C22C 13/00 (2006.01), H05K 3/34 (2006.01)
Applicants: FUJITSU LIMITED [JP/JP]; 1-1, Kamikodanaka 4-chome, Nakahara-ku, Kawasaki-shi, Kanagawa 211-8588 (JP) (For All Designated States Except US).
KITAJIMA, Masayuki [JP/JP]; (JP) (For US Only).
SHONO, Tadaaki [JP/JP]; (JP) (For US Only).
TAKESUE, Masakazu [JP/JP]; (JP) (For US Only).
NODA, Yutaka [JP/JP]; (JP) (For US Only)
Inventors: KITAJIMA, Masayuki; (JP).
SHONO, Tadaaki; (JP).
TAKESUE, Masakazu; (JP).
NODA, Yutaka; (JP)
Agent: ISHIDA, Takashi; A. AOKI, ISHIDA & ASSOCIATES, Toranomon 37 Mori Bldg., 5-1, Toranomon 3-chome, Minato-ku, Tokyo 105-8423 (JP)
Priority Data:
Title (EN) SOLDER ALLOY AND SOLDERED JOINT
(FR) ALLIAGE DE BRASAGE ET JOINT BRASE
Abstract: front page image
(EN)A solder alloy which does not exert adverse influences on the environment and has soldering properties equal to those of conventional Pb−Sn solder alloys; and a soldered joint made with the solder alloy. The solder alloy consists of 4.0 to 10.0 wt.% zinc, 1.0 to 15.0 wt.% indium, 0.0020 to 0.0100 wt.% aluminum, and tin and unavoidable impurities as the remainder. The soldered joint made with the solder alloy is useful in electrical/electronic appliances.
(FR)L'invention concerne un alliage de brasage n'ayant aucun effet néfaste sur l'environnement et présentant des propriétés de brasage égales à celles d'alliages de brasage classiques Pb-Sn ;ainsi qu'un joint brasé conçu au moyen dudit alliage. Celui-ci comprend entre 4,0 et 10,0 % en poids de zinc, entre 1,0 et 15,0 % en poids d'indium, entre 0,0020 et 0, 0100 % en poids d'aluminium, ainsi que de l'étain et d'inévitables impuretés comme reste. Le joint brasé conçu au moyen de l'alliage de brasage est utile dans des appareils électriques/électroniques.
Designated States: AE, AG, AL, AM, AT, AU, AZ, BA, BB, BG, BR, BY, BZ, CA, CH, CN, CO, CR, CU, CZ, DE, DK, DM, DZ, EC, EE, ES, FI, GB, GD, GE, GH, GM, HR, HU, ID, IL, IN, IS, JP, KE, KG, KR, KZ, LC, LK, LR, LS, LT, LU, LV, MA, MD, MG, MK, MN, MW, MX, MZ, NO, NZ, OM, PH, PL, PT, RO, RU, SD, SE, SG, SI, SK, SL, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VN, YU, ZA, ZM, ZW.
African Regional Intellectual Property Organization (GH, GM, KE, LS, MW, MZ, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AT, BE, CH, CY, DE, DK, ES, FI, FR, GB, GR, IE, IT, LU, MC, NL, PT, SE, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG).
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)