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Machine translation
1. (WO2003060990) ADVANCED PROCESS CONTROL (APC) OF COPPER THICKNESS FOR CHEMICAL MECHANICAL PLANARIZATION(CMP) OPTIMIZATION
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2003/060990    International Application No.:    PCT/US2002/028982
Publication Date: 24.07.2003 International Filing Date: 12.09.2002
Chapter 2 Demand Filed:    31.07.2003    
IPC:
H01L 21/66 (2006.01), H01L 21/768 (2006.01), H01L 23/532 (2006.01)
Applicants: ADVANCED MICRO DEVICES, INC. [US/US]; One AMD Place, Mail Stop 68, P.O. Box 3453, Sunnyvale, CA 94088-3453 (US)
Inventors: CHRISTIAN, Craig, William; (US).
STICE, James, Clayton; (US)
Agent: DRAKE, Paul, S.; Advanced Micro Devices, Inc., 5204 East Ben White Boulevard, Mail Stop 562, Austin, TX 78741 (US).
PICKER, Madeline, M.; Brookes Batchellor LLP, 102-108 Clerkenwell Road, London EC1M 5SA (GB)
Priority Data:
10/044,641 10.01.2002 US
Title (EN) ADVANCED PROCESS CONTROL (APC) OF COPPER THICKNESS FOR CHEMICAL MECHANICAL PLANARIZATION(CMP) OPTIMIZATION
(FR) COMMANDE DE PROCESSUS DE POINTE (APC) DE L'EPAISSEUR DU CUIVRE POUR OPTIMISATION DE LA PLANARISATION MECANO-CHIMIQUE (CMP)
Abstract: front page image
(EN)A method is provided that comprises forming a copper seed layer (335) on a workpiece (300) and measuring the uniformity of the copper seed layer (335) on the workpiece (300). The method further comprises applying the uniformity measurement to modify processing to form a copper layer (425) having a desired uniformity profile for increased planarization in subsequent planarizing.
(FR)L'invention concerne un procédé consistant à former une couche de germe de cuivre (335) sur une pièce (300) et à mesurer l'uniformité de cette couche de germe de cuivre (335) sur la pièce (300). Ce procédé consiste également à appliquer la mesure d'uniformité pour modifier le traitement afin de former une couche de cuivre (425) possédant un profil d'uniformité voulu pour une planarisation accrue lors de la planarisation subséquente.
Designated States: AE, AG, AL, AM, AT, AU, AZ, BA, BB, BG, BR, BY, BZ, CA, CH, CN, CO, CR, CU, CZ, DE, DK, DM, DZ, EC, EE, ES, FI, GB, GD, GE, GH, GM, HR, HU, ID, IL, IN, IS, JP, KE, KG, KP, KR, KZ, LC, LK, LR, LS, LT, LU, LV, MA, MD, MG, MK, MN, MW, MX, MZ, NO, NZ, OM, PH, PL, PT, RO, RU, SD, SE, SG, SI, SK, SL, TJ, TM, TN, TR, TT, TZ, UA, UG, UZ, VC, VN, YU, ZA, ZM, ZW.
African Regional Intellectual Property Organization (GH, GM, KE, LS, MW, MZ, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, IE, IT, LU, MC, NL, PT, SE, SK, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG).
Publication Language: English (EN)
Filing Language: English (EN)