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1. (WO2003060954) ETCHED HOLE-FILL STAND-OFF

Pub. No.:    WO/2003/060954    International Application No.:    PCT/US2002/040758
Publication Date: Jul 24, 2003 International Filing Date: Dec 19, 2002
IPC: H05K 3/40
Applicants: HONEYWELL ADVANCED CIRCUITS, INC.
LEE, Bruce
PEDIGO, Jesse
Inventors: LEE, Bruce
PEDIGO, Jesse
Title: ETCHED HOLE-FILL STAND-OFF
Abstract:
An assembly is disclosed that includes an etched hole-fill standoff (10); a tooling plate (23) contacting the etched hole-fill stand-off (10), the stand-off (10) and tooling plate (23) being aligned to each other; a device having holes to be filled removably contacting the stand-off (10), the stand-off (10) and device being aligned to each other; the device and the stand-off (10) each having at least one hole, the hole of the device being aligned with the hole of the stand-off (10). An assembly is also disclosed comprising an etched hole-fill standoff (10), the stand-off (10) comprising an etched layer bonded to a non-etched layer. A method of filling holes in a substrate having a plurality of holes to be filled includes the steps of providing an etched hole-fill stand-off (10), aligning the stand-off (10) to a tooling plate (23), aligning the substrate (30) to the stand off and placing the substrate (30) in contact with the stand-off, and filling the plurality of holes of the substrate (30).