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1. (WO2003060569) HIGH DENSITY INTEGRATED OPTICAL CHIP

Pub. No.:    WO/2003/060569    International Application No.:    PCT/US2003/000055
Publication Date: Jul 24, 2003 International Filing Date: Jan 2, 2003
IPC: G02B 6/12
G02B 6/122
G02B 6/124
G02B 6/132
G02B 6/30
Applicants: MASSACHUSSETTS INSTITUTE OF TECHNOLOGY
Inventors: LEE, Kevin, K.
LIM, Desmond, R.
WADA, Kazumi
KIMMERLING, Lionel, C.
Title: HIGH DENSITY INTEGRATED OPTICAL CHIP
Abstract:
A high density integrated optical chip (20). The optical chip features an optical function (26) connected to a low minimum bending radius dielectric waveguide (24), and a large mode field size dielectric waveguide (22) to interface with an external optical device (28), such as an optical fiber. The large mode field size dielectric waveguide is optically connected to the low minimum bending radius dielectric waveguide on the optical chip.