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1. (WO2003058719) MONOLITHIC INTERCONNECTION INTERFACE FOR THE STACKING OF ELECTRONIC COMPONENTS AND THE PRODUCTION METHOD THEREOF

Pub. No.:    WO/2003/058719    International Application No.:    PCT/FR2002/004009
Publication Date: Jul 17, 2003 International Filing Date: Nov 22, 2002
IPC: H01L 25/10
H05K 1/00
H05K 1/14
H05K 1/18
H05K 3/34
Applicants: SOCIETE NOVATEC
BOURRIERES, Francis
KAISER, Clément
Inventors: BOURRIERES, Francis
KAISER, Clément
Title: MONOLITHIC INTERCONNECTION INTERFACE FOR THE STACKING OF ELECTRONIC COMPONENTS AND THE PRODUCTION METHOD THEREOF
Abstract:
The invention relates to an interconnection interface (1) which can be used to create at least one additional interconnection surface level for the production of three-dimensional electronic assemblies. According to the invention, the base boxes (3), which provide the electric interconnection with said interface, are surface assembly components of the type which have gullwing connections that extend out from the boxes called SO, TSOP, QFP, etc. Said interface consists of a one-piece printed circuit comprising at least two faces and having non-through openings and metallised through holes, thereby fulfilling the mechanical separator and electric connection functions simultaneously. The upper face (4) of the interface (1) is flat and forms a receiving and interconnecting circuit and the surface thereof, which is totally free, can be adapted to the size of additional components. The lower face of said interface comprises at least two levels, namely: a first level (5) forming a circuit which is used simultaneously for the electric interconnection and the mechanical bearing on the supports (2) of the base box(es) (3) and the link via metallised holes (6) with the upper face (4); and a second level (7) forming the apex of an opening that is used for the passage of the body/bodies of the base box(es) to be avoided.