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1. (WO2003058696) METHOD OF PRODUCING METAL FILM

Pub. No.:    WO/2003/058696    International Application No.:    PCT/JP2002/013837
Publication Date: Fri Jul 18 01:59:59 CEST 2003 International Filing Date: Sat Dec 28 00:59:59 CET 2002
IPC: C25D 5/48
C25D 7/12
C25F 3/22
H01L 21/288
H01L 21/768
Applicants: SONY CORPORATION

SATO, Shuzo

NOGAMI, Takeshi

SEGAWA, Yuji

Inventors: SATO, Shuzo

NOGAMI, Takeshi

SEGAWA, Yuji

Title: METHOD OF PRODUCING METAL FILM
Abstract:
A current concentration caused by an additive (especially, a brightener) remaining/depositing at a high density at a grain boundary triple-point and in a wiring groove portion in a copper-plating film surface layer is eliminated to restrict a lead elution and an abnormal elution, thereby obtaining the electropolished surface of a copper-plating film excellent in surface smoothness. A method of producing a metal film comprising the step of using a plating solution added with a plating additive for restricting void generation, bottom-up fill and over-fill to form a metal plating film (copper plating film (15)), and the step of using an electropolishing solution added with a polishing additive that reacts/bonds with a plating additive component contained in or deposited on a metal plating film surface layer to electropolish a metal plating film.