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1. (WO2003056609) APPARATUS AND METHOD FOR ELECTROPLATING A WAFER SURFACE

Pub. No.:    WO/2003/056609    International Application No.:    PCT/IB2002/005396
Publication Date: Jul 10, 2003 International Filing Date: Dec 12, 2002
IPC: C25D 5/04
C25D 7/12
C25D 17/06
C25D 21/10
H01L 21/00
Applicants: KONINKLIJKE PHILIPS ELECTRONICS N.V.
DE KUBBER, Daan, L.
Inventors: DE KUBBER, Daan, L.
Title: APPARATUS AND METHOD FOR ELECTROPLATING A WAFER SURFACE
Abstract:
The present invention provides for a method of electroplating a wafer surface comprising introducing a plating liquid to the wafer surface in a chamber and rotating the wafer about an axis of rotation passing through the surface to be plated, and including the further step of moving the wafer such that its axis of rotation is itself caused to rotate about a second axis of rotation.