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Machine translation
1. (WO2003055958) ABRASIVE COMPOSITION CONTAINING ORGANIC PARTICLES FOR CHEMICAL MECHANICAL PLANARIZATION
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2003/055958    International Application No.:    PCT/US2002/040520
Publication Date: 10.07.2003 International Filing Date: 19.12.2002
Chapter 2 Demand Filed:    22.07.2003    
IPC:
C09G 1/02 (2006.01), C09K 3/14 (2006.01), H01L 21/321 (2006.01)
Applicants: DYNEA CANADA, LTD. [CA/CA]; 5865 McLaughlin Road, Unit 3, Mississauga, Ontario L5R 1B8 (CA) (For All Designated States Except US).
LI, Yuzhuo [US/US]; (US) (For US Only).
BIAN, Guomin [CA/CA]; (CA) (For US Only).
TANG, Kwok [CA/CA]; (CA) (For US Only).
ZHAO, Joe, Zunzi [CN/US]; (US) (For US Only).
WESTBROOK, John [US/US]; (US) (For US Only).
LIN, Yong [CN/US]; (US) (For US Only).
CHAN, Leina [CA/CA]; (CA) (For US Only)
Inventors: LI, Yuzhuo; (US).
BIAN, Guomin; (CA).
TANG, Kwok; (CA).
ZHAO, Joe, Zunzi; (US).
WESTBROOK, John; (US).
LIN, Yong; (US).
CHAN, Leina; (CA)
Agent: BAILEY, John, W.; Birch, Stewart, Kolasch & Birch, LLP, P.O. Box 747, Falls Church, VA 22040-0747 (US)
Priority Data:
10/023,827 21.12.2001 US
Title (EN) ABRASIVE COMPOSITION CONTAINING ORGANIC PARTICLES FOR CHEMICAL MECHANICAL PLANARIZATION
(FR) COMPOSITION ABRASIVE CONTENANT DES PARTICULES ORGANIQUES POUR PLANARISATION CHIMIOMECANIQUE
Abstract: front page image
(EN)The present invention is drawn to a composition comprising abrasive particles comprising an organic resin for chemical mechanical planarization (CMP), which can be widely used in the semiconductor industry. The abrasive composition is an aqueous slurry comprising abrasive particles comprising an organic resin, wherein the slurry is held at a pH in the range of 2-12. An attractive feature of the inventive abrasive composition is that it can be tailored to selectively remove different components from the surface. The inventive abrasive composition also provides efficient polishing rates and good surface quality when used in CMP applications.
(FR)La présente invention concerne une composition comprenant des particules abrasives à base de résine organique, destinée aux traitements de planarisation chimiomécanique couramment employés dans l'industrie des semi-conducteurs. Cette composition abrasive est une boue aqueuse comprenant des particules abrasives à base d'une résine organique, la boue conservant un pH se situant dans une plage de 2 à 12. L'un des avantages de la composition abrasive de l'invention est qu'elle peut être confectionnée en respectant des paramètres permettant d'éliminer sélectivement de la surface différents composants. La composition abrasive de l'invention donne également de bons rendements de polissage ainsi qu'une bonne qualité de surface en utilisation pour les applications de planarisation chimiomécanique.
Designated States: AE, AG, AL, AM, AT, AU, AZ, BA, BB, BG, BR, BY, BZ, CA, CH, CN, CO, CR, CU, CZ, DE, DK, DM, DZ, EC, EE, ES, FI, GB, GD, GE, GH, GM, HR, HU, ID, IL, IN, IS, JP, KE, KG, KP, KR, KZ, LC, LK, LR, LS, LT, LU, LV, MA, MD, MG, MK, MN, MW, MX, MZ, NO, NZ, OM, PH, PL, PT, RO, RU, SC, SD, SE, SG, SK, SL, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, YU, ZA, ZM, ZW.
African Regional Intellectual Property Organization (GH, GM, KE, LS, MW, MZ, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, IE, IT, LU, MC, NL, PT, SE, SI, SK, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG).
Publication Language: English (EN)
Filing Language: English (EN)