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1. WO2003009659 - METHOD FOR FORMING CONDUCTING LAYER ONTO SUBSTRATE

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Publication Number WO/2003/009659
Publication Date 30.01.2003
International Application No. PCT/GB2002/003248
International Filing Date 17.07.2002
Chapter 2 Demand Filed 14.02.2003
IPC
H05K 3/18 2006.1
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3Apparatus or processes for manufacturing printed circuits
10in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
18using precipitation techniques to apply the conductive material
H05K 3/24 2006.1
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3Apparatus or processes for manufacturing printed circuits
22Secondary treatment of printed circuits
24Reinforcing of the conductive pattern
CPC
H05K 3/182
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3Apparatus or processes for manufacturing printed circuits
10in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
18using precipitation techniques to apply the conductive material
181by electroless plating
182characterised by the patterning method
H05K 3/246
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3Apparatus or processes for manufacturing printed circuits
22Secondary treatment of printed circuits
24Reinforcing the conductive pattern
245Reinforcing conductive patterns made by printing techniques or by other techniques for applying conductive pastes, inks or powders; Reinforcing other conductive patterns by such techniques
246Reinforcing conductive paste, ink or powder patterns by other methods, e.g. by plating
Applicants
  • BRUNEL UNIVERSITY [GB]/[GB] (AllExceptUS)
  • EVANS, Peter, Sidney, Albert [GB]/[GB] (UsOnly)
  • HARRISON, David [GB]/[GB] (UsOnly)
Inventors
  • EVANS, Peter, Sidney, Albert
  • HARRISON, David
Agents
  • TOLLETT, Ian
Priority Data
0117431.717.07.2001GB
Publication Language English (en)
Filing Language English (EN)
Designated States
Title
(EN) METHOD FOR FORMING CONDUCTING LAYER ONTO SUBSTRATE
(FR) PROCEDE DE FORMATION D'UNE COUCHE DE CONDUCTION SUR UN SUBSTRAT
Abstract
(EN) A process for forming a conductive layer on a substrate is disclosed which comprises the steps of providing an ink comprising a metal oxide in particulate form suspended in a mixture of a resin and an organic solvent, depositing the ink on a substrate by means of a lithographic printing process, and applying a reducing agent to the ink to reduce at least some of said metal oxide to metal. Preferably, a mixture of an alkyd and a non-alkyd resin is employed.
(FR) L'invention concerne un procédé de formation d'une couche conductrice sur un substrat. Ledit procédé comprend les étapes de : production d'une encre comprenant un oxyde métallique sous forme particulaire en suspension dans un mélange d'une résine et d'un solvant organique ; déposition de l'encre sur un substrat au moyen d'un processus d'impression lithographique ; application d'un agent réducteur sur l'encre afin de réduire au moins une partie dudit oxyde métallique en métal. On utilisera, de préférence, un mélange de résines alkyde et non-alkyde.
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