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Machine translation
1. (WO2003009346) PROCESSING SYSTEM
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2003/009346    International Application No.:    PCT/US2002/022006
Publication Date: 30.01.2003 International Filing Date: 13.07.2002
Chapter 2 Demand Filed:    31.01.2003    
IPC:
H01L 21/00 (2006.01), H01L 21/677 (2006.01), H01L 21/687 (2006.01)
Applicants: APPLIED MATERIALS,INC. [US/US]; 3050 Bowers Avenue Santa Clara, CA 95054 (US) (For All Designated States Except US).
QUILES, Efrain [US/US]; (US) (For US Only).
BEHDJAT, Mehran [US/US]; (US) (For US Only).
LOWRANCE, Robert, B. [US/US]; (US) (For US Only).
RICE, Michael, Robert [US/US]; (US) (For US Only).
VOPAT, Brent [US/US]; (US) (For US Only)
Inventors: QUILES, Efrain; (US).
BEHDJAT, Mehran; (US).
LOWRANCE, Robert, B.; (US).
RICE, Michael, Robert; (US).
VOPAT, Brent; (US)
Agent: DUGAN, Brian, M.; Dugan & Dugan, PC, 55 South Broadway, Tarrytown, NY 10591 (US)
Priority Data:
60/305,679 15.07.2001 US
Title (EN) PROCESSING SYSTEM
(FR) SYSTEME DE TRAITEMENT
Abstract: front page image
(EN)In a first aspect, a first substrate processing system is provided that includes (1) a chamber having a plurality of openings through which a substrate may be transported; (2) a substrate carrier opener coupled to a first one of the plurality of openings; (3) a thermal processing chamber coupled to a second one of the plurality of openings; and (4) a wafer handler contained within the chamber, having a substrate clamping blade and a blade adapted to transport high temperature substrates. Numerous other aspects are provided, as are methods and computer program products in accordance with these and other aspects.
(FR)Selon un premier aspect, la présente invention concerne un système de traitement d'un premier substrat qui comprend (1) une chambre comportant une pluralité d'ouvertures à travers lesquelles un substrat peut être transporté; (2) un dispositif d'ouverture de porte-substrat couplé à une première ouverture faisant partie des multiples ouvertures; (3) une chambre de traitement thermique couplée à une deuxième desdites multiples ouvertures; et (4) un manipulateur de tranches logé dans la chambre, qui comprend une lame de fixation de substrats et une lame prévue pour transporter des substrats à haute température. Cette invention concerne également de nombreux autres aspects ainsi que des procédés et des produits de programmes d'ordinateur pouvant s'appliquer à tous ces aspects.
Designated States: AE, AG, AL, AM, AT, AU, AZ, BA, BB, BG, BR, BY, BZ, CA, CH, CN, CO, CR, CU, CZ, DE, DK, DM, DZ, EC, EE, ES, FI, GB, GD, GE, GH, GM, HR, HU, ID, IL, IN, IS, JP, KE, KG, KP, KR, KZ, LC, LK, LR, LS, LT, LU, LV, MA, MD, MG, MK, MN, MW, MX, MZ, NO, NZ, PL, PT, RO, RU, SD, SE, SG, SK, SL, TJ, TM, TR, TT, TZ, UA, UG, US, UZ, VN, YU, ZA, ZW.
African Regional Intellectual Property Organization (GH, GM, KE, LS, MW, MZ, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, IE, IT, LU, MC, NL, PT, SE, SK, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG).
Publication Language: English (EN)
Filing Language: English (EN)