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1. WO2003008310 - DEVICE FOR CUTTING THROUGH AN ADHESIVE STRIP AND METHOD FOR PREPARING AN ADHERING LOCATION

Publication Number WO/2003/008310
Publication Date 30.01.2003
International Application No. PCT/DE2002/002598
International Filing Date 16.07.2002
Chapter 2 Demand Filed 23.12.2002
IPC
B65H 19/10 2006.1
BPERFORMING OPERATIONS; TRANSPORTING
65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
HHANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
19Changing the web roll
10in unwinding mechanisms or in connection with unwinding operations
CPC
B65H 19/102
BPERFORMING OPERATIONS; TRANSPORTING
65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
HHANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
19Changing the web roll
10in unwinding mechanisms or in connection with unwinding operations
102Preparing the leading end of the replacement web before splicing operation; Adhesive arrangements on leading end of replacement web; Tabs and adhesive tapes for splicing
B65H 2301/4148
BPERFORMING OPERATIONS; TRANSPORTING
65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
HHANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
2301Handling processes for sheets or webs
40Type of handling process
41Winding, unwinding
414Winding
4148slitting
B65H 2301/4607
BPERFORMING OPERATIONS; TRANSPORTING
65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
HHANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
2301Handling processes for sheets or webs
40Type of handling process
46Splicing
4606Preparing leading edge for splicing
4607by adhesive tape
B65H 2301/51512
BPERFORMING OPERATIONS; TRANSPORTING
65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
HHANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
2301Handling processes for sheets or webs
50Auxiliary process performed during handling process
51Modifying a characteristic of handled material
515Cutting handled material
5151transversally to feeding direction
51512using a cutting member moving linearly in a plane parallel to the surface of the web and along a direction crossing the handled material
B65H 2301/5152
BPERFORMING OPERATIONS; TRANSPORTING
65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
HHANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
2301Handling processes for sheets or webs
50Auxiliary process performed during handling process
51Modifying a characteristic of handled material
515Cutting handled material
5152Cutting partially, e.g. perforating
B65H 2301/5153
BPERFORMING OPERATIONS; TRANSPORTING
65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
HHANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
2301Handling processes for sheets or webs
50Auxiliary process performed during handling process
51Modifying a characteristic of handled material
515Cutting handled material
5153Details of cutting means
Applicants
  • KOENIG & BAUER AKTIENGESELLSCHAFT [DE]/[DE] (AllExceptUS)
  • BECK, Peter, Franz [DE]/[DE] (UsOnly)
Inventors
  • BECK, Peter, Franz
Common Representative
  • KOENIG & BAUER AKTIENGESELLSCHAFT
Priority Data
101 35 180.119.07.2001DE
Publication Language German (de)
Filing Language German (DE)
Designated States
Title
(DE) VORRICHTUNG ZUM DURCHTRENNEN EINES KLEBEBANDES UND VERFAHREN ZUR VORBEREITUNG EINER KLEBESTELLE
(EN) DEVICE FOR CUTTING THROUGH AN ADHESIVE STRIP AND METHOD FOR PREPARING AN ADHERING LOCATION
(FR) DISPOSITIF POUR SECTIONNER UNE BANDE ADHESIVE ET PROCEDE POUR PREPARER UN EMPLACEMENT DE COLLAGE
Abstract
(DE) Die Erfindung betrifft eine Vorrichtung (08) zum Durchtrennen eines Klebebandes (06), das auf zumindest einer Seite mit einer durch ein Abdeckband (12) abgedeckten Klebeschicht (11) versehen ist, mit einer Fördereinrichtung (04, 18), mittels der das Klebeband (06) in eine Klebezone (09) gefördert werden kann, und einer Schneideinrichtung (21), mit der das Klebeband (06) in einer Schnittzone (19) durchtrennt werden kann. Die Schneideinrichtung (21) ist dabei derart ausgebildet, dass die Schneideinrichtung (21) ein Durchtrennen des Klebebands (06) unter Erhalt einer Verbindung des am Klebeband anliegenden Abdeckbandes (12) über die Schnittzone (19) hinweg erlaubt. Außerdem ein Verfahren zur Vorbereitung einer Klebestelle.
(EN) The invention relates to a device (08) for cutting through an adhesive strip (06) which, on at least one side, is provided with an adhesive layer (11) that is covered by a covering strip (12). Said device comprises a conveying unit (04, 18) by means of which the adhesive strip (06) can be conveyed into an adhering zone (09), and comprises a cutting implement (21) with which the adhesive strip (06) can be cut through in a cutting zone (19). The cutting implement (21) is designed whereby enabling the adhesive strip (06) to be cut through while preserving a connection of the covering strip (12), which rests on the adhesive strip, over the cutting zone (19). The invention also relates to a method for preparing an adhering location.
(FR) L'invention concerne un dispositif (08) pour sectionner une bande adhésive (06) dotée, au moins sur une face, d'une couche adhésive (11) recouverte d'une bande de protection (12). Ce dispositif comporte un dispositif de transport (04, 18), au moyen duquel la bande adhésive (06) est transportée dans une zone de collage (09), ainsi qu'un dispositif de coupe (21), qui permet de sectionner la bande adhésive (06) dans une zone de coupe (19). Le dispositif de coupe (21) est conçu de sorte à permettre un sectionnement de la bande adhésive (06), tout en conservant une liaison avec la bande de protection (12) adjacente à la bande adhésive au niveau de la zone de coupe (19). La présente invention porte également sur un procédé pour préparer un emplacement de collage.
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