WO2003007671 INTERCONNECT STRUCTURE FOR INTERCONNECTING ELECTRONIC MODULES

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Publication Number WO/2003/007671

Publication Date 23.01.2003

International Application No. PCT/US2002/016155

International Filing Date 22.05.2002

Chapter 2 Demand Filed 18.12.2002

IPC

CPC

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Applicants

HARRIS CORPORATION [US]/[US]

Inventors

CLARK, William, E.
HECKAMAN, Douglas, E.
BAJGROWICZ, Edward, J.

Agents

YATSKO, Michael, S.

Priority Data

09/871,167

31.05.2001

Publication Language English (en)

Filing Language English (EN)

Designated States

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Title

(EN) INTERCONNECT STRUCTURE FOR INTERCONNECTING ELECTRONIC MODULES

(FR) STRUCTURE D'INTERCONNEXION POUR INTERCONNECTER DES MODULES ELECTRONIQUES

Abstract

(EN) An interconnect structure interconnects electronic modules (32) and includes a backplane assembly (34) formed from a substantially rigid backplane plate that carries RF connectors (38) and a digital motherboard (46) having digital connectors (48) for mating with digital connectors (32b) of electronic modules (32). A controlled impedance interconnect circuit is positioned on the rear surface of the backplane plate and interconnects the RF connectors (38) carried by the backplane plate and digital connectors (48) of the digital motherboard (46). A rack (54) receives the backplane assembly (34) and supports a plurality of electronic modules (32) that are interconnected to each other via the backplane assembly (34).

(FR) Structure d'interconnexion permettant d'interconnecter des modules électroniques (32), qui comprend un ensemble fond de panier (34) constitué d'une plaque de fond de panier sensiblement rigide et comportant des connecteurs HF (38), et d'une carte-mère numérique (46) à connecteurs numériques (48) s'assemblant avec des connecteurs numériques (32b) de modules électroniques (32). Un circuit d'interconnexion à impédance réglée, placé sur la surface arrière de la plaque de fond de panier, interconnecte les connecteurs HF (38) de ladite plaque et des connecteurs numériques (48) de la carte-mère numérique (46). Un bâti (54) reçoit l'ensemble fond de panier (34) et comporte une pluralité de modules électroniques (32) interconnectés entre eux par l'ensemble fond de panier (34).

G	PHYSICS
02	OPTICS
B	OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS
6	Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
24	Coupling light guides
36	Mechanical coupling means
38	having fibre to fibre mating means

H	ELECTRICITY
05	ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K	PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
7	Constructional details common to different types of electric apparatus
14	Mounting supporting structure in casing or on frame or rack

G	PHYSICS
02	OPTICS
B	OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS
6	Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
24	Coupling light guides
36	Mechanical coupling means
38	having fibre to fibre mating means

H	ELECTRICITY
05	ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K	PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
7	Constructional details common to different types of electric apparatus
14	Mounting supporting structure in casing or on frame or rack

G	PHYSICS
02	OPTICS
B	OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS
6	Light guides
24	Coupling light guides
36	Mechanical coupling means
38	having fibre to fibre mating means
3807	Dismountable connectors, i.e. comprising plugs
3897	Connectors fixed to housings, casings, frames, circuit boards

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1. WO2003007671 - INTERCONNECT STRUCTURE FOR INTERCONNECTING ELECTRONIC MODULES

H	ELECTRICITY
01	BASIC ELECTRIC ELEMENTS
R	ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
12	Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCBs], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
70	Coupling devices
71	for rigid printing circuits or like structures
712	co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit

H	ELECTRICITY
01	BASIC ELECTRIC ELEMENTS
R	ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
13	Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
648	Protective earth or shield arrangements on coupling devices ; , e.g. anti-static shielding;
658	High frequency shielding arrangements, e.g. against EMI [Electro-Magnetic Interference] or EMP [Electro-Magnetic Pulse]

H	ELECTRICITY
01	BASIC ELECTRIC ELEMENTS
R	ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
13	Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
648	Protective earth or shield arrangements on coupling devices ; , e.g. anti-static shielding;
658	High frequency shielding arrangements, e.g. against EMI [Electro-Magnetic Interference] or EMP [Electro-Magnetic Pulse]