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Machine translation
1. (WO2003007374) HYBRID MODULE
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2003/007374    International Application No.:    PCT/JP2002/007090
Publication Date: 23.01.2003 International Filing Date: 12.07.2002
Chapter 2 Demand Filed:    12.07.2002    
IPC:
H01L 23/13 (2006.01), H01L 25/065 (2006.01), H01L 25/16 (2006.01)
Applicants: HITACHI, LTD. [JP/JP]; 6, Kanda Surugadai 4-chome, Chiyoda-ku, Tokyo 101-8010 (JP) (For All Designated States Except US).
MIWA, Takao [JP/JP]; (JP) (For US Only).
SATOH, Toshiya [JP/JP]; (JP) (For US Only).
OGINO, Masahiko [JP/JP]; (JP) (For US Only).
NABATAME, Toshihide [JP/JP]; (JP) (For US Only).
MOTOWAKI, Shigehisa [JP/JP]; (JP) (For US Only).
WATAHIKI, Seiji [JP/JP]; (JP) (For US Only).
FUKUMOTO, Hideshi [JP/JP]; (JP) (For US Only).
FURUKAWA, Yoko [JP/JP]; (JP) (For US Only).
AKAMINE, Hitoshi [JP/JP]; (JP) (For US Only).
ENDO, Tsuneo [JP/JP]; (JP) (For US Only).
KUBO, Masaharu [JP/JP]; (JP) (For US Only)
Inventors: MIWA, Takao; (JP).
SATOH, Toshiya; (JP).
OGINO, Masahiko; (JP).
NABATAME, Toshihide; (JP).
MOTOWAKI, Shigehisa; (JP).
WATAHIKI, Seiji; (JP).
FUKUMOTO, Hideshi; (JP).
FURUKAWA, Yoko; (JP).
AKAMINE, Hitoshi; (JP).
ENDO, Tsuneo; (JP).
KUBO, Masaharu; (JP)
Agent: TAKADA, Yukihiko; 1-48, Saiwai-cho 2-chome, Hitachi-shi, Ibaraki 317-0073 (JP)
Priority Data:
2001-211537 12.07.2001 JP
2001-211534 12.07.2001 JP
Title (EN) HYBRID MODULE
(FR) MODULE HYBRIDE
Abstract: front page image
(EN)A hybrid module which uses an integrated passive element formed by integrating passive elements, and is mounted thereon with a small/low profile, heating integrated circuit that is mounted in a recess formed in a circuit board.
(FR)L'invention concerne un module hybride utilisant un élément passif intégré formé par intégration d'éléments passifs. Ce module est monté sur ledit élément avec un profil réduit/surbaissé, un circuit intégré de chauffage étant disposé dans un évidement ménagé dans une carte de circuit imprimé.
Designated States: US.
European Patent Office (AT, BE, CH, CY, DE, DK, ES, FI, FR, GB, GR, IE, IT, LU, MC, NL, PT, SE, TR).
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)