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Machine translation
1. (WO2003005774) CONTAINER FOR ENCAPSULATING OLED AND MANUFACTURING METHOD THEREOF
Latest bibliographic data on file with the International Bureau   

Pub. No.: WO/2003/005774 International Application No.: PCT/KR2002/000994
Publication Date: 16.01.2003 International Filing Date: 24.05.2002
Chapter 2 Demand Filed: 23.12.2002
IPC:
H01L 51/52 (2006.01)
Applicants: HUH, Jin Woo[KR/KR]; KR (UsOnly)
OH, Jae Yeol[KR/KR]; KR (UsOnly)
ORION ELECTRIC CO., LTD.[KR/KR]; 165 Gongdan-dong, Gumi-shi 730-030 Gyoungsangbuk-do, KR (AllExceptUS)
Inventors: HUH, Jin Woo; KR
OH, Jae Yeol; KR
Agent: LEE, Hoo Dong; 10th Floor, Hankook Tire Bldg., 647-15 Yoksam-dong, Gangnam-gu 135-723 Seoul, KR
Priority Data:
2001/2862924.05.2001KR
Title (EN) CONTAINER FOR ENCAPSULATING OLED AND MANUFACTURING METHOD THEREOF
(FR) BAC D'ENCAPSULATION DE DIODES ELECTROLUMINESCENTES ORGANIQUES ET SON PROCEDE DE FABRICATION
Abstract: front page image
(EN) The present invention relates to a container for encapsulating organic light emitting diodes (hereinafter, referred to as OLED ) and a manufacturing method thereof, wherein a container for encapsulating OLEDs is manufactured by forming a sealant in a glass sheet using a glass frit, thereby resulting in improving the characteristic of junction between the container and the top substrate.
(FR) La présente invention concerne un bac d'encapsulation de diodes électroluminescentes organiques (ci-après appelées OLED) et un procédé de fabrication dudit bac. Selon ledit procédé, un bac d'encapsulation d'OLED est fabriqué par formation d'un matériau d'étanchéité dans une feuille de verre à l'aide d'une fritte de verre, améliorant ainsi la caractéristique de jonction entre le bac et le substrat supérieur.
Designated States: CN, JP, KR, US
European Patent Office (EPO) (AT, BE, CH, CY, DE, DK, ES, FI, FR, GB, GR, IE, IT, LU, MC, NL, PT, SE, TR)
Publication Language: English (EN)
Filing Language: Korean (KO)