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Machine translation
1. (WO2003005342) SIGNAL COUPLING METHOD AND APPARATUS
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2003/005342    International Application No.:    PCT/JP2002/006479
Publication Date: 16.01.2003 International Filing Date: 27.06.2002
IPC:
G10L 13/06 (2006.01)
Applicants: KABUSHIKI KAISHA KENWOOD [JP/JP]; 14-6, Dougenzaka 1-chome, Shibuya-ku, Tokyo 150-8501 (JP) (For All Designated States Except US).
ADVANCED TELECOMMUNICATIONS RESEARCH INSTITUTE INTERNATIONAL [JP/JP]; 2-2, Hikaridai 2-chome, Seika-cyo, Souraku-gun, Kyoto 619-0288 (JP) (For All Designated States Except US).
SATO, Yasushi [JP/JP]; (JP) (For US Only).
DAVIN, Patrick [US/JP]; (JP) (For US Only)
Inventors: SATO, Yasushi; (JP).
DAVIN, Patrick; (JP)
Agent: OKABE, Masao; No. 602, Fuji Bidg, 2-3, Marunouchi 3-chome, Chiyoda-ku, Tokyo 100-0005 (JP)
Priority Data:
2001-201408 02.07.2001 JP
Title (EN) SIGNAL COUPLING METHOD AND APPARATUS
(FR) PROCEDE ET APPAREIL DE COUPLAGE DE SIGNAUX
Abstract: front page image
A signal coupling method and a signal coupling apparatus capable of creating a naturally combined speech with a reduced noise. The signal coupling method (or apparatus) couples a plurality of waveform signals to create a combined waveform signal by a step (or means) for deciding the upper limit frequency of each frequency spectrum of the plurality of waveform signals and a step (or means) for filtering at least coupled portion of each waveform signal by a predetermined cut−off frequency characteristic based on the decided upper limit frequency. Here, the filtering cut−off frequency is set to an upper limit frequency of a waveform signal preceding or following the coupled portion of the waveform signal having a higher upper limit frequency. Accordingly, a higher harmonic component generated by discontinuous change of the coupled portion of the waveform signals is effectively removed, thereby significantly reducing the noise of the combined waveform signal.
Designated States: AU, CA, CN, KR, US.
European Patent Office (AT, BE, CH, CY, DE, DK, ES, FI, FR, GB, GR, IE, IT, LU, MC, NL, PT, SE, TR).
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)