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1. (WO2003001293) PHOTOSENSITIVE POLYIMIDE PRECURSOR COMPOSITIONS
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2003/001293    International Application No.:    PCT/US2001/041188
Publication Date: 03.01.2003 International Filing Date: 28.06.2001
IPC:
G03F 7/029 (2006.01), G03F 7/037 (2006.01)
Applicants: ARCH SPECIALTY CHEMICALS, INC. [US/US]; 501 Merrit 7, P.O. Box 4500, Norwalk, CT 06856-4500 (US)
Inventors: NAIINI, Ahmad; (US).
RACICOT, Donald; (US).
ROZA, Andrew, J.; (US).
WEBER, WilLiam, D.; (US)
Agent: GREELEY, Paul, D.; Ohlandt, Greeley, Ruggiero & Perle, L.L.P., 10th floor, One Landmark Square, Stamford, CT 06901-2682 (US)
Priority Data:
09/886,626 20.06.2001 US
Title (EN) PHOTOSENSITIVE POLYIMIDE PRECURSOR COMPOSITIONS
(FR) COMPOSITIONS DE PRECURSEUR POLYIMIDE PHOTOSENSIBLES
Abstract: front page image
(EN)Reducing inhibition of the photochemical crosslinking by including in the photosensitive polyimide precursor composition a metal inhibitor selected from 1H-tetrazole, 1,2-cyclohexenediamine tetraacetic acid hydrate and 5-mercaptobenzimidazole.
(FR)L'invention vise à réduire l'inhibition de la réticulation photochimique par l'inclusion, dans une composition de précurseur polyimide photosensible, d'un inhibiteur métallique sélectionné dans le groupe comprenant 1H-tétrazole, hydrate d'acide 1,2-cyclohexènediamine tétra-acétique et 5-mercaptobenzimidazole.
Designated States: JP, KR, SG.
European Patent Office (AT, BE, CH, CY, DE, DK, ES, FI, FR, GB, GR, IE, IT, LU, MC, NL, PT, SE, TR).
Publication Language: English (EN)
Filing Language: English (EN)