WO2002099881 HEATSINK ASSEMBLY AND METHOD OF MANUFACTURING THE SAME

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Publication Number WO/2002/099881

Publication Date 12.12.2002

International Application No. PCT/US2002/017687

International Filing Date 04.06.2002

IPC

CPC

Applicants

HEAT TECHNOLOGY, INC. [US]/[US]

Inventors

LARSON, Ralph, I.

Agents

DALY, Christopher, S.

Priority Data

60/295,932	05.06.2001	US
60/305,007	12.07.2001	US
60/369,726	04.04.2002	US

Publication Language English (en)

Filing Language English (EN)

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Title

(EN) HEATSINK ASSEMBLY AND METHOD OF MANUFACTURING THE SAME

(FR) ENSEMBLE RADIATEUR ET PROCEDE DE FABRICATION

Abstract

(EN) A heat removal system includes a heatsink assembly having a base and a plurality of heat conducting folded fin members projecting from a first surface of the base and arranged to leave an open space on the first surface of the base. At least one thermally conductive slug projects from the center of the folded fin members and the folded fin members are thermally coupled to the slug. A gas circulating system is disposed over the slug and fin members projecting from the first surface of the base. The sidewall of a fin may be provided with at least one aperture. The top surface of the fin is closed, thereby permitting the fin to operate as a plenum of sorts. The bottom of the troughs may also be closed. The fins/troughs act as a plenum. A method of producing the folded fin heatsink member is also described.

(FR) L'invention concerne un système d'évacuation de la chaleur comprenant un ensemble radiateur pourvu d'une base et d'une pluralité d'ailettes pliées thermoconductrices sailllantes sur une première surface de la base et placées de manière à laisser un espace ouvert sur la première surface de la base. Au moins un tronçon thermoconducteur se détache du centre des ailettes pliées, et celles-ci sont thermiquement couplées au tronçon. Un système de circulation du gaz est situé sur le tronçon et les ailettes saillantes de la première surface de la base. La paroi latérale d'une ailette peut comprendre au moins une ouverture. La surface supérieure de l'ailette est fermée, permettant ainsi à l'ailette de servir de chambre de distribution. La partie inférieure des creux peut également être fermée. Les ailettes/creux servent de chambre de distribution. L'invention concerne également un procédé de fabrication du radiateur à ailettes pliées.

H	ELECTRICITY
01	BASIC ELECTRIC ELEMENTS
L	SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21	Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02	Manufacture or treatment of semiconductor devices or of parts thereof
04	the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer
48	Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups H01L21/06-H01L21/326201

H	ELECTRICITY
01	BASIC ELECTRIC ELEMENTS
L	SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23	Details of semiconductor or other solid state devices
34	Arrangements for cooling, heating, ventilating or temperature compensation
36	Selection of materials, or shaping, to facilitate cooling or heating, e.g. heat sinks
367	Cooling facilitated by shape of device

H	ELECTRICITY
01	BASIC ELECTRIC ELEMENTS
L	SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21	Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02	Manufacture or treatment of semiconductor devices or of parts thereof
04	the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer
48	Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups H01L21/06-H01L21/326201

H	ELECTRICITY
01	BASIC ELECTRIC ELEMENTS
L	SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23	Details of semiconductor or other solid state devices
34	Arrangements for cooling, heating, ventilating or temperature compensation
36	Selection of materials, or shaping, to facilitate cooling or heating, e.g. heat sinks
367	Cooling facilitated by shape of device

H	ELECTRICITY
01	BASIC ELECTRIC ELEMENTS
L	SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21	Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02	Manufacture or treatment of semiconductor devices or of parts thereof
04	the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
48	Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
4814	Conductive parts
4871	Bases, plates or heatsinks
4878	Mechanical treatment, e.g. deforming

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1. WO2002099881 - HEATSINK ASSEMBLY AND METHOD OF MANUFACTURING THE SAME

H	ELECTRICITY
01	BASIC ELECTRIC ELEMENTS
L	SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2924	Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
0001	Technical content checked by a classifier
0002	Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

H	ELECTRICITY
01	BASIC ELECTRIC ELEMENTS
L	SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2924	Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
0001	Technical content checked by a classifier
0002	Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00