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1. WO2002042240 - A HEAT CONDUCTIVE MATERIAL

Publication Number WO/2002/042240
Publication Date 30.05.2002
International Application No. PCT/EP2001/010439
International Filing Date 10.09.2001
Chapter 2 Demand Filed 19.06.2002
IPC
C04B 35/52 2006.01
CCHEMISTRY; METALLURGY
04CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
BLIME; MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
35Shaped ceramic products characterised by their composition; Ceramic compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
515based on non-oxides
52based on carbon, e.g. graphite
H01L 23/373 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
34Arrangements for cooling, heating, ventilating or temperature compensation
36Selection of materials, or shaping, to facilitate cooling or heating, e.g. heat sinks
373Cooling facilitated by selection of materials for the device
CPC
C04B 35/52
CCHEMISTRY; METALLURGY
04CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
BLIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE
35Shaped ceramic products characterised by their composition
515based on non-oxide ceramics
52based on carbon, e.g. graphite
H01L 23/3732
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
34Arrangements for cooling, heating, ventilating or temperature compensation ; ; Temperature sensing arrangements
36Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
373Cooling facilitated by selection of materials for the device ; or materials for thermal expansion adaptation, e.g. carbon
3732Diamonds
H01L 2924/0002
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2924Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
0001Technical content checked by a classifier
0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Y10T 428/25
YSECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
10TECHNICAL SUBJECTS COVERED BY FORMER USPC
TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
428Stock material or miscellaneous articles
25Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles
Y10T 428/252
YSECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
10TECHNICAL SUBJECTS COVERED BY FORMER USPC
TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
428Stock material or miscellaneous articles
25Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles
252Glass or ceramic [i.e., fired or glazed clay, cement, etc.] [porcelain, quartz, etc.]
Y10T 428/31678
YSECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
10TECHNICAL SUBJECTS COVERED BY FORMER USPC
TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
428Stock material or miscellaneous articles
31504Composite [nonstructural laminate]
31678Of metal
Applicants
  • SKELETON TECHNOLOGIES AG [CH]/[CH] (AllExceptUS)
  • EKSTRÖM, Thommy [SE]/[SE] (UsOnly)
  • ZHENG, Jie [SE]/[SE] (UsOnly)
  • KLOUB, Kauthar [SE]/[SE] (UsOnly)
  • GORDEEV, Sergey, K [RU]/[RU] (UsOnly)
  • DANCHUKOVA, Liya, V [RU]/[RU] (UsOnly)
Inventors
  • EKSTRÖM, Thommy
  • ZHENG, Jie
  • KLOUB, Kauthar
  • GORDEEV, Sergey, K
  • DANCHUKOVA, Liya, V
Agents
  • ALBIHNS STOCKHOLM AB
Priority Data
200012940321.11.2000RU
Publication Language English (EN)
Filing Language English (EN)
Designated States
Title
(EN) A HEAT CONDUCTIVE MATERIAL
(FR) MATERIAU CONDUCTEUR DE CHALEUR
Abstract
(EN)
This invention relates to diamond-containing composite materials that have high thermal conductivity and thermal diffusivity, and to the use of said materials in heat sinks, heat spreading and other heat conductive applications. The material comprises diamond particles, silicone carbide and silicon, and has a thermal conductivity of at least 400 W/mK and a thermal diffusivity of at least 2.1 cm2/s.
(FR)
L'invention concerne des matériaux composites contenant du diamant qui présentent une conductivité thermique et une diffusivité thermique élevées. Cette invention concerne également l'utilisation de ces matériaux dans des dissipateurs thermiques, des répartiteurs thermiques ainsi que dans d'autres applications conductrices de chaleur. Le matériau de l'invention comprend des particules de diamant, du carbure de silicium et du silicium et présente une conductivité thermique d'au moins 400W/mK et une diffusivité thermique d'au moins 2,1 cm2/s.
Also published as
PH1-2003-500339
PH12003500339
RU2003118430
ZA200303525
Other related publications
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