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1. WO2002040987 - AUTOMATED ACOUSTIC MICRO IMAGING SYSTEM AND METHOD

Publication Number WO/2002/040987
Publication Date 23.05.2002
International Application No. PCT/US2001/051365
International Filing Date 13.11.2001
Chapter 2 Demand Filed 03.05.2002
IPC
G01N 29/22 2006.01
GPHYSICS
01MEASURING; TESTING
NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
29Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
22Details
G01N 29/28 2006.01
GPHYSICS
01MEASURING; TESTING
NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
29Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
22Details
28providing acoustic coupling
H01L 21/00 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
H01L 21/677 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
677for conveying, e.g. between different work stations
CPC
G01N 2291/2697
GPHYSICS
01MEASURING; TESTING
NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
2291Indexing codes associated with group G01N29/00
26Scanned objects
269Various geometry objects
2697Wafer or (micro)electronic parts
G01N 29/223
GPHYSICS
01MEASURING; TESTING
NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
29Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
22Details ; , e.g. general constructional or apparatus details
223Supports, positioning or alignment in fixed situation
G01N 29/225
GPHYSICS
01MEASURING; TESTING
NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
29Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
22Details ; , e.g. general constructional or apparatus details
225Supports, positioning or alignment in moving situation
G01N 29/28
GPHYSICS
01MEASURING; TESTING
NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
29Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
22Details ; , e.g. general constructional or apparatus details
28providing acoustic coupling ; , e.g. water
H01L 21/67288
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; ; Apparatus not specifically provided for elsewhere
67005Apparatus not specifically provided for elsewhere
67242Apparatus for monitoring, sorting or marking
67288Monitoring of warpage, curvature, damage, defects or the like
H01L 21/67778
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; ; Apparatus not specifically provided for elsewhere
677for conveying, e.g. between different workstations
67763the wafers being stored in a carrier, involving loading and unloading
67778involving loading and unloading of waers
Applicants
  • SONOSCAN, INC. [US]/[US]
Inventors
  • ORAVECZ, Michael, G.
  • ERICKSON, Daniel, M.
  • MICEK, Daniel, W.
Agents
  • FELDMAN, Steve, E.
Priority Data
09/715,35917.11.2000US
Publication Language English (EN)
Filing Language English (EN)
Designated States
Title
(EN) AUTOMATED ACOUSTIC MICRO IMAGING SYSTEM AND METHOD
(FR) SYSTEME ET PROCEDE DE MICRO-IMAGERIE ACOUSTIQUE AUTOMATISES
Abstract
(EN)
An automated acoustic micro imaging system includes a part-storage station (22) favoring a dry environment, a part-transport robot, and a wet-environment inspection station. The wet-environment inspection station (20) has an ultrasonic beam generator, a coupling fluid in which parts are inspected, and a part-retention stage (93). A moisture barrier (52) is located between the wet-environment inspection station and the part-storage station (93) favoring a dry environment. The inspection station includes a kinematic, quick-change part-retaining chuck and robotic means for interchanging chucks. Automatic acoustic micro imaging methods are disclosed.
(FR)
L'invention concerne un système de micro-imagerie acoustique automatisé comprenant une station de stockage de partie (22) favorisant une environnement sec, un robot de transport de partie, et une station d'inspection en environnement humide. La station d'inspection en environnement (20) humide comporte un générateur de faisceau ultrasonore, un fluide de couplage dans lequel des parties sont inspectées, et un étage de rétention de partie (93). Un barrière contre l'humidité (52) est disposée entre la station d'inspection en environnement humide et la station de stockage de partie (93) favorisant un environnement sec. La station d'inspection comprend un support de maintien de partie, cinématique, à changement rapide et des moyens robot destinés à interchanger les supports. L'invention concerne aussi des procédés de micro-imagerie acoustique automatisés.
Also published as
Latest bibliographic data on file with the International Bureau