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1. WO2002036848 - TANTALUM OR TUNGSTEN TARGET-COPPER ALLOY BACKING PLATE ASSEMBLY AND PRODUCTION METHOD THEREFOR

Publication Number WO/2002/036848
Publication Date 10.05.2002
International Application No. PCT/JP2001/006553
International Filing Date 30.07.2001
Chapter 2 Demand Filed 19.10.2001
IPC
C23C 14/34 2006.01
CCHEMISTRY; METALLURGY
23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
14Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
22characterised by the process of coating
34Sputtering
CPC
C23C 14/3407
CCHEMISTRY; METALLURGY
23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
14Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
22characterised by the process of coating
34Sputtering
3407Cathode assembly for sputtering apparatus, e.g. Target
Y10T 428/12743
YSECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
10TECHNICAL SUBJECTS COVERED BY FORMER USPC
TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
428Stock material or miscellaneous articles
12All metal or with adjacent metals
12493Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
12736Al-base component
12743Next to refractory [Group IVB, VB, or VIB] metal-base component
Y10T 428/12819
YSECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
10TECHNICAL SUBJECTS COVERED BY FORMER USPC
TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
428Stock material or miscellaneous articles
12All metal or with adjacent metals
12493Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
12771Transition metal-base component
12806Refractory [Group IVB, VB, or VIB] metal-base component
12819Group VB metal-base component
Y10T 428/12826
YSECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
10TECHNICAL SUBJECTS COVERED BY FORMER USPC
TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
428Stock material or miscellaneous articles
12All metal or with adjacent metals
12493Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
12771Transition metal-base component
12806Refractory [Group IVB, VB, or VIB] metal-base component
12826Group VIB metal-base component
Applicants
  • NIKKO MATERIALS COMPANY, LIMITED [JP]/[JP] (AllExceptUS)
  • ODA, Kunihiro [JP]/[JP] (UsOnly)
  • OKABE, Takeo [JP]/[JP] (UsOnly)
  • MIYASHITA, Hirohito [JP]/[JP] (UsOnly)
Inventors
  • ODA, Kunihiro
  • OKABE, Takeo
  • MIYASHITA, Hirohito
Agents
  • OGOSHI, Isamu
Priority Data
2000-33215931.10.2000JP
Publication Language Japanese (JA)
Filing Language Japanese (JA)
Designated States
Title
(EN) TANTALUM OR TUNGSTEN TARGET-COPPER ALLOY BACKING PLATE ASSEMBLY AND PRODUCTION METHOD THEREFOR
(FR) ENSEMBLE CIBLE EN TANTALE OU TUNGSTÈNE SUR PLAQUE-SUPPORT EN ALLIAGE DE CUIVRE, ET PROCÉDÉ DE PRODUCTION
Abstract
(EN)
A tantalum or tungsten target-copper alloy backing plate assembly which comprises a tantalum or tungsten target and a copper alloy backing plate that are diffusion-joined via an aluminium- or aluminium alloy-sheet insert material at least 0.5 mm thick, and which is provided with diffusion-joint interfaces between the respective materials, wherein the assembly suffers only a small deformation after diffusion-joining and is free from separation between the target and the backing plate or from cracking even when the target materiel and the backing plate differ greatly in thermal expansion coefficient, and can survive high-power sputtering; and a production method therefor.
(FR)
La présente invention concerne un ensemble cible en tantale ou tungstène sur plaque-support en alliage de cuivre. En l'occurrence, l'ensemble est constitué d'une cible en tantale ou en tungstène et d'une plaque support en alliage de cuivre réunies par diffusion au moyen d'un matériau d'insert à base de tôle d'aluminium ou d'alliage d'aluminium de 0,5 mm d'épaisseur. L'ensemble présente entre les différents matériaux des interfaces de jonction par diffusion. L'ensemble ne présente qu'une faible déformation après la jonction par diffusion, tout en étant exempt de séparation entre la cible et la plaque support ou de craquelure, même si le matériau de la cible et de la plaque support présentent de grandes différences de coefficients de dilatation. En outre, l'ensemble résiste à la pulvérisation cathodique à grande puissance. L'invention concerne également un procédé de production correspondant.
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