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1. (WO2002031228) COPPER ELECTROPLATING USING INSOLUBLE ANODE

Pub. No.:    WO/2002/031228    International Application No.:    PCT/JP2001/008853
Publication Date: Apr 18, 2002 International Filing Date: Oct 9, 2001
IPC: C25D 3/38
Applicants: LEARONAL JAPAN INC.

SEITA, Masaru

TSUCHIDA, Hideki

KUSAKA, Masaru

Inventors: SEITA, Masaru

TSUCHIDA, Hideki

KUSAKA, Masaru

Title: COPPER ELECTROPLATING USING INSOLUBLE ANODE
Abstract:
A copper electroplating using an insoluble anode is characterized in that a substrate is plated by a DC current by using an electrolytic copper plating solution containing a compound having in a molecule a -X-S-Y- structure (where X and Y are atoms selected from the group consisting of a hydrogen atom, a carbon atom, a sulfur atom, a nitrogen atom, and an oxygen atom, and can be the same only when they are carbon atoms). Even a predetermined time after the initial make-up of the electrolytic bath, plating metal can be stably precipitated, a filled via is formed, and the MVH can be filled with a metal with no void.