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1. (WO2002031219) ELECTROSTATICALLY CLAMPED EDGE RING FOR PLASMA PROCESSING
Latest bibliographic data on file with the International Bureau   

Pub. No.: WO/2002/031219 International Application No.: PCT/US2001/030286
Publication Date: 18.04.2002 International Filing Date: 26.09.2001
Chapter 2 Demand Filed: 25.04.2002
IPC:
C23C 16/458 (2006.01) ,H01L 21/00 (2006.01) ,H01L 21/683 (2006.01)
C CHEMISTRY; METALLURGY
23
COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
C
COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
16
Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition (CVD) processes
44
characterised by the method of coating
458
characterised by the method used for supporting substrates in the reaction chamber
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21
Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21
Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67
Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
683
for supporting or gripping
Applicants:
HUBACEK, Jerome S. [US/US]; US (UsOnly)
LAM RESEARCH CORPORATION [US/US]; 4650 Cushing Parkway Fremont, CA 94538, US (AllExceptUS)
Inventors:
HUBACEK, Jerome S.; US
Agent:
PETERSON, James W.; BURNS, DOANE, SWECKER & MATHIS, LLP P.O. BOX 1404 Alexandria, VA 22313-1404, US
Priority Data:
09/680,51506.10.2000US
Title (EN) ELECTROSTATICALLY CLAMPED EDGE RING FOR PLASMA PROCESSING
(FR) ANNEAU DE BORDURE FIXE PAR ELECTROSTATIQUE POUR LE TRAITEMENT AU PLASMA
Abstract:
(EN) A coupling ring assembly including an edge ring supported by an electrostatic edge ring chuck and a method of improving the temperature control of an edge ring in a plasma processing chamber. The edge ring can be made of a conductive material such as silicon or silicon carbide and temperature control of the edge ring can be enhanced by supplying heat transfer gas such as helium between opposed surfaces of the edge ring and the edge ring chuck.
(FR) L'invention concerne un ensemble d'anneau de couplage comprenant un anneau de bordure porté par un support de tranche d'anneau de bordure électrostatique, ainsi qu'un procédé d'amélioration de la régulation thermique d'un anneau de bordure dans une chambre de traitement au plasma. On peut élaborer l'anneau de bordure à partir d'une matière conductrice, telle que le silicium ou le carbure de silicium, et on peut améliorer la régulation thermique dudit anneau en distribuant un gaz de transfert thermique tel que l'hélium entre les surfaces opposées de l'anneau de bordure et du support de tranche dudit anneau.
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Designated States: AE, AG, AL, AM, AT, AU, AZ, BA, BB, BG, BR, BY, BZ, CA, CH, CN, CO, CR, CU, CZ, DE, DK, DM, DZ, EC, EE, ES, FI, GB, GD, GE, GH, GM, HR, HU, ID, IL, IN, IS, JP, KE, KG, KP, KR, KZ, LC, LK, LR, LS, LT, LU, LV, MA, MD, MG, MK, MN, MW, MX, MZ, NO, NZ, PH, PL, PT, RO, RU, SD, SE, SG, SI, SK, SL, TJ, TM, TR, TT, TZ, UA, UG, US, UZ, VN, YU, ZA, ZW
African Regional Intellectual Property Organization (ARIPO) (GH, GM, KE, LS, MW, MZ, SD, SL, SZ, TZ, UG, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (EPO) (AT, BE, CH, CY, DE, DK, ES, FI, FR, GB, GR, IE, IT, LU, MC, NL, PT, SE, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG)
Publication Language: English (EN)
Filing Language: English (EN)