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1. (WO2002029865) METHOD OF MANUFACTURING A SEMICONDUCTOR COMPONENT AND SEMICONDUCTOR COMPONENT THEREOF
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2002/029865    International Application No.:    PCT/US2001/031035
Publication Date: 11.04.2002 International Filing Date: 04.10.2001
Chapter 2 Demand Filed:    04.04.2002    
IPC:
H01L 21/02 (2006.01), H01L 21/316 (2006.01)
Applicants: MOTOROLA, INC. [US/US]; 1303 East Algonquin Road, Schaumburg, IL 60196 (US)
Inventors: HENRY, Haldane, S.; (US).
HILL, Darrell, G.; (US).
ABROKWAH, Jonathan, K.; (US).
SADAKA, Mariam, G.; (US)
Agent: KOCH, William, E.; Motorola Labs, Corporate Law Department, Intellectual Law Section, 7700 West Parmer Lane, MD: TX32/PL02, Austin, TX 78729 (US)
Priority Data:
09/679,861 05.10.2000 US
Title (EN) METHOD OF MANUFACTURING A SEMICONDUCTOR COMPONENT AND SEMICONDUCTOR COMPONENT THEREOF
(FR) PROCEDE DE FABRICATION D'UN COMPOSANT A SEMI-CONDUCTEUR ET COMPOSANT AINSI OBTENU
Abstract: front page image
(EN)A method of manufacturing a semiconductor component includes forming a first capacitor electrode (126) over a substrate (110), forming a capacitor dielectric layer (226) over the first capacitor electrode (126), and forming a second capacitor electrode (326) over the capacitor dielectric layer (226). The capacitor dielectric layer (226) is made of aluminum.
(FR)Procédé de fabrication d'un composant à semi-conducteur, qui consiste à former une première électrode (126) de condensateur sur un substrat (110), à former une couche diélectrique (226) de condensateur sur la première électrode (126) de condensateur et à former une seconde électrode (326) de condensateur sur la couche diélectrique (226) de condensateur. La couche diélectrique (226) de condensateur est en aluminium.
Designated States: AE, AG, AL, AM, AT, AU, AZ, BA, BB, BG, BR, BY, BZ, CA, CH, CN, CO, CR, CU, CZ, DE, DK, DM, DZ, EC, EE, ES, FI, GB, GD, GE, GH, GM, HR, HU, ID, IL, IN, IS, JP, KE, KG, KP, KR, KZ, LC, LK, LR, LS, LT, LU, LV, MA, MD, MG, MK, MN, MW, MX, MZ, NO, NZ, PH, PL, PT, RO, RU, SD, SE, SG, SI, SK, SL, TJ, TM, TR, TT, TZ, UA, UG, UZ, VN, YU, ZA, ZW.
African Regional Intellectual Property Organization (GH, GM, KE, LS, MW, MZ, SD, SL, SZ, TZ, UG, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AT, BE, CH, CY, DE, DK, ES, FI, FR, GB, GR, IE, IT, LU, MC, NL, PT, SE, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG).
Publication Language: English (EN)
Filing Language: English (EN)