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1. (WO2002028160) MICROFLUIDIC DEVICES FOR HEAT TRANSFER
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2002/028160    International Application No.:    PCT/US2001/030659
Publication Date: 04.04.2002 International Filing Date: 28.09.2001
Chapter 2 Demand Filed:    16.04.2002    
IPC:
B81B 1/00 (2006.01), G11B 33/14 (2006.01), H01L 23/473 (2006.01), H05K 7/20 (2006.01)
Applicants: NANOSTREAM, INC. [US/US]; 580 Sierra Madre Villa Ave., Pasadena, CA 91107-2928 (US)
Inventors: O'CONNOR, Stephen, D.; (US).
DANTSKER, Eugene; (US)
Agent: GUSTAFSON, Vincent, K.; Nanostream, Inc., 580 Sierra Madre Villa Avenue, Pasadena, CA 91107-2928 (US).
VIERING JENTSCHURA & PARTNER; Steinsdorfstr. 6, 80538 München (DE)
Priority Data:
60/236,838 29.09.2000 US
Title (EN) MICROFLUIDIC DEVICES FOR HEAT TRANSFER
(FR) DISPOSITIFS MICROFLUIDIQUES POUR TRANSFERT THERMIQUE
Abstract: front page image
(EN)In accordance with the present invention there is provided a microfluidic heat exchange system for cooling heat-generating components of electronic equipment, computers, lasers, analytical instruments, medical equipment and the like. Both direct contact and indirect contact microfluidic systems are described. Also described are microfluidic systems that incorporate remote heat rejection systems that may be located outside the body of the equipment that contains the heat generating components that need cooling.
(FR)L'invention concerne un système microfluidique de transfert thermique permettant de refroidir des composants générateurs de chaleur dans des équipements électroniques, des ordinateurs, des lasers, des instruments analytiques, des équipements médicaux et autres. L'invention concerne à la fois des systèmes microfluidiques à contact direct et indirect. L'invention concerne en outre des systèmes microfluidiques dotés d'unités externes d'évacuation de la chaleur qui sont susceptibles d'être installées à l'extérieur du corps de l'équipement renfermant les composants générateurs de chaleur à refroidir.
Designated States: AE, AG, AL, AM, AT, AU, AZ, BA, BB, BG, BR, BY, BZ, CA, CH, CN, CO, CR, CU, CZ, DE, DK, DM, DZ, EC, EE, ES, FI, GB, GD, GE, GH, GM, HR, HU, ID, IL, IN, IS, JP, KE, KG, KP, KR, KZ, LC, LK, LR, LS, LT, LU, LV, MA, MD, MG, MK, MN, MW, MX, MZ, NO, NZ, PH, PL, PT, RO, RU, SD, SE, SG, SI, SK, SL, TJ, TM, TR, TT, TZ, UA, UG, UZ, VN, YU, ZA, ZW.
African Regional Intellectual Property Organization (GH, GM, KE, LS, MW, MZ, SD, SL, SZ, TZ, UG, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AT, BE, CH, CY, DE, DK, ES, FI, FR, GB, GR, IE, IT, LU, MC, NL, PT, SE, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG).
Publication Language: English (EN)
Filing Language: English (EN)