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Machine translation
1. (WO2002028156) METHOD AND DEVICE FOR FLOW SOLDERING
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2002/028156    International Application No.:    PCT/JP2001/008298
Publication Date: 04.04.2002 International Filing Date: 25.09.2001
IPC:
B23K 1/00 (2006.01), B23K 1/012 (2006.01), B23K 1/08 (2006.01), B23K 1/20 (2006.01), B23K 3/06 (2006.01), B23K 3/08 (2006.01)
Applicants: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. [JP/JP]; 1006, Oaza Kadoma, Kadoma-shi, Osaka 571-8501 (JP) (For All Designated States Except US).
KAWASHIMA, Yasuji [JP/JP]; (JP) (For US Only).
SUETSUGU, Kenichiro [JP/JP]; (JP) (For US Only).
HIBINO, Shunji [JP/JP]; (JP) (For US Only).
TAKANO, Hiroaki [JP/JP]; (JP) (For US Only).
OKUJI, Tatsuo [JP/JP]; (JP) (For US Only).
KABASHIMA, Shoshi [JP/JP]; (JP) (For US Only).
MAEDA, Yukio [JP/JP]; (JP) (For US Only).
NAKATA, Mikiya [JP/JP]; (JP) (For US Only)
Inventors: KAWASHIMA, Yasuji; (JP).
SUETSUGU, Kenichiro; (JP).
HIBINO, Shunji; (JP).
TAKANO, Hiroaki; (JP).
OKUJI, Tatsuo; (JP).
KABASHIMA, Shoshi; (JP).
MAEDA, Yukio; (JP).
NAKATA, Mikiya; (JP)
Agent: AOYAMA, Tamotsu; AOYAMA & PARTNERS, IMP Building, 3-7, Shiromi 1-chome, Chuo-ku, Osaka-shi, Osaka 540-0001 (JP)
Priority Data:
2000-292271 26.09.2000 JP
2000-299423 29.09.2000 JP
Title (EN) METHOD AND DEVICE FOR FLOW SOLDERING
(FR) PROCEDE ET DISPOSITIF DE SOUDAGE A VAGUE
Abstract: front page image
(EN)A method of flow-soldering for mounting an electronic component on a substrate by using lead-free soldering material as soldering material, comprising the steps of installing a heating cover (10) above a preheater (3) and passing the substrate (11) through a clearance between the preheater and the heating cover, wherein a clearance (d1) between the preheater and a soldering tank (5) is set to 20 to 60 mm, and a clearance between a primary jet (7) and a secondary jet (8) is set to 60 mm or less, whereby the efficiency of the flow soldering can be increased in a preheat process or soldering material feeding process.
(FR)L'invention porte sur un procédé de soudage à vague utilisé pour monter un composant informatique sur un substrat utilisant une soudure sans plomb et consistant à installer un couvercle chauffant (10) au-dessus d'un préchauffage (3) puis à faire passer le substrat dans l'espace compris entre le couvercle chauffant et le préchauffage, l'espace (d1) entre le préchauffage et le réservoir de soudure (5) étant compris entre 20 et 60 mm, et l'espace entre un jet primaire (7) et un deuxième jet (8) étant de 60 mm ou moins. On accroît l'efficacité du soudage du fait du préchauffage et du processus d'apport de la soudure.
Designated States: US.
European Patent Office (AT, BE, CH, CY, DE, DK, ES, FI, FR, GB, GR, IE, IT, LU, MC, NL, PT, SE, TR).
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)