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Machine translation
1. (WO2002027792) LOW INDUCTIVE WIRE BOND CHIP PACKAGING
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2002/027792    International Application No.:    PCT/US2001/029643
Publication Date: 04.04.2002 International Filing Date: 20.09.2001
Chapter 2 Demand Filed:    09.04.2002    
IPC:
H01L 23/498 (2006.01), H01L 23/50 (2006.01), H01L 23/64 (2006.01)
Applicants: CONEXANT SYSTEMS, INC. [US/US]; 4311 Jamboree Road E08-801 Newport Beach, CA 92660 (US) (For All Designated States Except US).
FAZELPOUR, Siamak [IR/US]; (US) (For US Only).
HASHEMI, Hassan, S. [US/US]; (US) (For US Only)
Inventors: FAZELPOUR, Siamak; (US).
HASHEMI, Hassan, S.; (US)
Agent: BENASSI, John, M.; Brobeck, Phleger & Harrison 12390 El Camino Real San Diego, CA 92130 (US)
Priority Data:
09/672,222 27.09.2000 US
Title (EN) LOW INDUCTIVE WIRE BOND CHIP PACKAGING
(FR) BOITIERS DE PUCES A LIAISON PAR FILS A FAIBLE INDUCTION
Abstract: front page image
(EN)A chip that comprises a plurality of chip pads and a substrate that comprises a first tier and a second tier are provided. The first tier of the substrate comprises a plurality of substrate bond pads and the second tier of the substrate comprises a plurality of substrate bond pads. At least two of the chip pads are connected to at least two of the substrate bond pads on the first tier. Additionally, at least two of the chip pads are connected to at least two of the substrate bond pads on the second tier.
(FR)L'invention concerne une puce comprenant plusieurs plots et un substrat comprenant un premier niveau et un second niveau. Le premier niveau et le second niveau du substrat comportent plusieurs plots de connexion. Au moins deux des plots de la puce sont connectés à au moins deux des plots de connexion du premier niveau. Au moins deux des plots de la puce sont, en outre, connectés à au moins deux des plots de connexion du second niveau.
Designated States: AE, AG, AL, AM, AT, AU, AZ, BA, BB, BG, BR, BY, BZ, CA, CH, CN, CO, CR, CU, CZ, DE, DK, DM, DZ, EC, EE, ES, FI, GB, GD, GE, GH, GM, HR, HU, ID, IL, IN, IS, JP, KE, KG, KP, KR, KZ, LC, LK, LR, LS, LT, LU, LV, MA, MD, MG, MK, MN, MW, MX, MZ, NO, NZ, PH, PL, PT, RO, RU, SD, SE, SG, SI, SK, SL, TJ, TM, TR, TT, TZ, UA, UG, US, UZ, VN, YU, ZA, ZW.
African Regional Intellectual Property Organization (GH, GM, KE, LS, MW, MZ, SD, SL, SZ, TZ, UG, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AT, BE, CH, CY, DE, DK, ES, FI, FR, GB, GR, IE, IT, LU, MC, NL, PT, SE, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG).
Publication Language: English (EN)
Filing Language: English (EN)