Search International and National Patent Collections

1. (WO2002027074) METHOD FOR SELECTIVELY METALLIZING DIELECTRIC MATERIALS

Pub. No.:    WO/2002/027074    International Application No.:    PCT/EP2001/010935
Publication Date: Apr 4, 2002 International Filing Date: Sep 21, 2001
IPC: C23C 18/16
C25D 5/02
C25D 5/54
C25D 5/56
H05K 3/18
Applicants: ENTHONE-OMI (DEUTSCHLAND) GMBH
LPKF LASER & ELECTRONICS AG
HUPE, Jürgen
KRONENBERG, Walter
KICKELHAIN, Jörg
MEIER, Dieter, J.
Inventors: HUPE, Jürgen
KRONENBERG, Walter
KICKELHAIN, Jörg
MEIER, Dieter, J.
Title: METHOD FOR SELECTIVELY METALLIZING DIELECTRIC MATERIALS
Abstract:
The invention relates to a method for selectively metallizing dielectric materials. To this end, the invention provides that an activation layer made of a conductive material is applied to the dielectric and is subsequently structured by a laser treatment, whereby resulting in the provision of a composite of discretely conductive structures, which can be electrolytically metallized afterwards. The inventive method is particularly used in the production of electronics elements, for example, printed circuit boards. Said method enables a precise structuring in dimensions less than νm, thus leading to a high density of configuration and a high quality of the conductor tracks, which are produced by using the aforementioned method.