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1. (WO2002026660) METHOD FOR JOINING
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2002/026660    International Application No.:    PCT/JP2001/008645
Publication Date: 04.04.2002 International Filing Date: 01.10.2001
Chapter 2 Demand Filed:    15.01.2002    
IPC:
C04B 35/645 (2006.01), C04B 37/00 (2006.01), C30B 33/00 (2006.01), C30B 33/06 (2006.01), G01L 9/00 (2006.01)
Applicants: YAMATAKE CORPORATION [JP/JP]; 12-19, Shibuya 2-chome Shibuya-ku, Tokyo 150-8316 (JP) (For All Designated States Except US).
MASUDA, Takashi [JP/JP]; (JP) (For US Only)
Inventors: MASUDA, Takashi; (JP)
Agent: YAMAKAWA, Masaki; c/o Yamakawa International Patent 0ffice 8th Floor, Shuwa-Tameike Building 4-2, Nagatacho 2-chome Chiyoda-ku, Tokyo 100-0014 (JP)
Priority Data:
2000-298152 29.09.2000 JP
Title (EN) METHOD FOR JOINING
(FR) PROCEDE DE RACCORDEMENT
Abstract: front page image
(EN)A method for joining a substrate (101) and another substrate (103) which comprises applying an aqueous solution of boehmite (AlO(OH)), which is a hydroxylated mineral of aluminium, on the substrate (101) to form an applied film (102) and subjecting the applied film (102) to a modification treatment.
(FR)L'invention concerne un procédé permettant de raccorder un substrat (101) à un autre substrat (103), qui consiste à appliquer une solution aqueuse de boehmite (AlO(OH)), un minéral hydroxylé d'aluminium, sur un substrat (101) pour former un film appliqué (102), que l'on soumet à un traitement de modification.
Designated States: CN, KR, US.
European Patent Office (AT, BE, CH, CY, DE, DK, ES, FI, FR, GB, GR, IE, IT, LU, MC, NL, PT, SE, TR).
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)