WIPO logo
Mobile | Deutsch | Español | Français | 日本語 | 한국어 | Português | Русский | 中文 | العربية |
PATENTSCOPE

Search International and National Patent Collections
World Intellectual Property Organization
Search
 
Browse
 
Translate
 
Options
 
News
 
Login
 
Help
 
Machine translation
1. (WO2002026443) ARRANGEMENT FOR POLISHING DISK-LIKE OBJECTS
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2002/026443    International Application No.:    PCT/EP2001/010186
Publication Date: 04.04.2002 International Filing Date: 04.09.2001
Chapter 2 Demand Filed:    16.04.2002    
IPC:
B24B 41/06 (2012.01), H01L 21/304 (2006.01)
Applicants: INFINEON TECHNOLOGIES SC300 GMBH & CO. KG [DE/DE]; Königsbrücker Strasse 180 01099 Dresden (DE) (For All Designated States Except US).
EBNER, Katrin [DE/DE]; (DE) (For US Only).
GLASHAUSER, Walter [DE/US]; (US) (For US Only)
Inventors: EBNER, Katrin; (DE).
GLASHAUSER, Walter; (US)
Agent: EPPING HERMANN & FISCHER; Ridlerstrasse 55 80339 Munich (DE)
Priority Data:
00121485.7 29.09.2000 EP
Title (EN) ARRANGEMENT FOR POLISHING DISK-LIKE OBJECTS
(FR) DISPOSITIF POUR POLIR DES OBJETS RESSEMBLANT A DES DISQUES
Abstract: front page image
(EN)A polish head (3) for Chemical Mechanical Polishing comprises a backing film (5) made of silicone on a rigid support element (6, 7), preferably consisting of amorphous ceramic. The silicone backing film (5) is fabricated by molding, thereby enabling an appropriate cross-sectional shape for specific polishing needs. The invention provides a uniform polishing of a semiconductor wafer (4).
(FR)L'invention concerne une tête de polissage (3) pour polissage mécano-chimique comportant un film support (5) en silicone sur un élément de support rigide (6,7), de préférence en céramique amorphe. Le film support (5) en silicone est fabriqué par moulage, ce qui lui donne une forme transversale adaptée aux besoins spécifiques du polissage. L'invention a trait à un polissage uniforme d'une plaquette à semi-conducteur (4).
Designated States: JP, KR, SG, US.
European Patent Office (AT, BE, CH, CY, DE, DK, ES, FI, FR, GB, GR, IE, IT, LU, MC, NL, PT, SE, TR).
Publication Language: English (EN)
Filing Language: English (EN)