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1. WO2002025732 - POWER MODULE WITH INTEGRATED CAPACITOR

Publication Number WO/2002/025732
Publication Date 28.03.2002
International Application No. PCT/US2001/029503
International Filing Date 20.09.2001
Chapter 2 Demand Filed 19.04.2002
IPC
H01L 23/66 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
58Structural electrical arrangements for semiconductor devices not otherwise provided for
64Impedance arrangements
66High-frequency adaptations
H01L 25/07 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
25Assemblies consisting of a plurality of individual semiconductor or other solid state devices
03all the devices being of a type provided for in the same subgroup of groups H01L27/-H01L51/128
04the devices not having separate containers
07the devices being of a type provided for in group H01L29/78
H05K 1/02 2006.01
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1Printed circuits
02Details
H05K 1/03 2006.01
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1Printed circuits
02Details
03Use of materials for the substrate
CPC
H01L 2223/665
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2223Details relating to semiconductor or other solid state devices covered by the group H01L23/00
58Structural electrical arrangements for semiconductor devices not otherwise provided for
64Impedance arrangements
66High-frequency adaptations
6644Packaging aspects of high-frequency amplifiers
665Bias feed arrangements
H01L 23/50
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
48Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; ; Selection of materials therefor
50for integrated circuit devices, ; e.g. power bus, number of leads
H01L 23/66
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
58Structural electrical arrangements for semiconductor devices not otherwise provided for ; , e.g. in combination with batteries
64Impedance arrangements
66High-frequency adaptations
H01L 25/072
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
25Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; ; Multistep manufacturing processes thereof
03all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L51/00, e.g. assemblies of rectifier diodes
04the devices not having separate containers
07the devices being of a type provided for in group H01L29/00
072the devices being arranged next to each other
H01L 2924/0002
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2924Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
0001Technical content checked by a classifier
0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
H01L 2924/01039
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2924Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
01Chemical elements
01039Yttrium [Y]
Applicants
  • BALLARD POWER SYSTEMS CORPORATION [US]/[US] (AllExceptUS)
  • PARKHILL, Scott [US]/[US] (UsOnly)
  • AHMED, Sayeed [BD]/[US] (UsOnly)
  • FLETT, Fred [GB]/[US] (UsOnly)
  • MALY, Douglas [US]/[US] (UsOnly)
Inventors
  • PARKHILL, Scott
  • AHMED, Sayeed
  • FLETT, Fred
  • MALY, Douglas
Agents
  • DIMINO, Michael
  • MESSULAM, Alec, Moses
Priority Data
60/233,99220.09.2000US
60/233,99320.09.2000US
60/233,99420.09.2000US
60/233,99520.09.2000US
60/233,99620.09.2000US
Publication Language English (EN)
Filing Language English (EN)
Designated States
Title
(EN) POWER MODULE WITH INTEGRATED CAPACITOR
(FR) ATTÉNUATION DU PARASITAGE ÉLECTROMAGNÉTIQUE DANS LES MODULES D'ALIMENTATION ÉLECTRIQUE PAR UTILISATION DE CONDENSATEURS INTÉGRÉS AU NIVEAU DU SUBSTRAT
Abstract
(EN)
A high frequency, low impedance network is integrated into the substrate level of a power module for the reduction of electromagnetic interference ('EMI'). In one embodiment, capacitance is electrically connected to at least one of the positive conducting layer in a substrate or the negative conducting layer in a substrate and a ground. Integrating a capacitive network of low stray inductance in a substrate of a power module allows relatively small, inexpensive capacitors to be used.
(FR)
La présente invention concerne un réseau H.F. faible impédance intégré dans le niveau du substrat d'un module d'alimentation électrique de façon à atténuer le parasitage électromagnétique. Selon un mode de réalisation, la capacitance est électriquement connectée, d'une part à une couche de conduction du substrat (négatif ou positif), et d'autre part à la masse. Cette intégration de réseau capacitif à faible inductance diffusée dans un substrat de module d'alimentation électrique permet l'utilisation de condensateurs relativement petits et bon marché.
Also published as
Latest bibliographic data on file with the International Bureau