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1. WO2002025707 - METHOD AND APPARATUS FOR ALIGNMENT OF CARRIERS AND SEMICONDUCTOR PROCESSING EQUIPMENT

Publication Number WO/2002/025707
Publication Date 28.03.2002
International Application No. PCT/US2001/029852
International Filing Date 20.09.2001
Chapter 2 Demand Filed 03.04.2002
IPC
H01L 21/68 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
68for positioning, orientation or alignment
CPC
H01L 21/68
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; ; Apparatus not specifically provided for elsewhere
68for positioning, orientation or alignment
Applicants
  • APPLIED MATERIALS, INC. [US]/[US]
Inventors
  • LAPPEN, Alan, Rick
Agents
  • BERNADICOU, Michael, A.
Priority Data
09/668,01221.09.2000US
Publication Language English (EN)
Filing Language English (EN)
Designated States
Title
(EN) METHOD AND APPARATUS FOR ALIGNMENT OF CARRIERS AND SEMICONDUCTOR PROCESSING EQUIPMENT
(FR) PROCEDE ET APPAREIL UTILES POUR ALIGNER DES SUPPORTS ET UNE INSTALLATION DE TRAITEMENT DE SEMI-CONDUCTEURS
Abstract
(EN)
A support and alignment coupling and method are provided in which a support and alignment coupling for aligning a semiconductor substrate carrier to semiconductor processing equipment has a rail-shaped contact portion adapted to be received by a carrier receptacle. As a consequence, alignment between the carrier and the processing equipment may be improved.
(FR)
La présente invention concerne un couplage de soutien et d'alignement et un procédé associé dans lequel un couplage de soutien et d'alignement servant à aligner un support de substrat à semi-conducteurs sur une installation de traitement de semi-conducteurs comprend une partie de contact en forme de rail adaptée pour se loger dans un contenant du support. De cette manière, l'alignement entre le support et l'installation de traitement peut être amélioré.
Also published as
Latest bibliographic data on file with the International Bureau